Google will do the computing core design for the TPU 8t (Training) chip, with MediaTek providing the I/O die and back-end design services (packaging), media report, citing unnamed supply chain. Broadcom will do the TPU 8i, due out Q3 this year, followed by 8t in Q4. In 2027, TPUs v8e and v8p will be out in Q4, with 8e by Google/MediaTek and 8p by Broadcom. Marvell is not part of the TPU supply chain, the article says. TSMC will manufacture the TPU 8t on its N3P process and provide CoWoS-S packaging. $Alphabet(GOOGL.US) $Taiwan Semiconductor(TSM.US) $Broadcom(AVGO.US) $Marvell Tech(MRVL.US) #Mediatek #semiconductors #semiconductor
Source: Dan Nystedt
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