📢 𝐉𝐔𝐒𝐓 𝐈𝐍: $Synopsys(SNPS.US) Synopsys Laun

📢 𝐉𝐔𝐒𝐓 𝐈𝐍: $Synopsys(SNPS.US) Synopsys Launches Multiphysics Fusion Solutions for Advanced Chip Design

👉 𝐊𝐞𝐲 𝐇𝐢𝐠𝐡𝐥𝐢𝐠𝐡𝐭𝐬:

➤ 𝐒𝐲𝐧𝐨𝐩𝐬𝐲𝐬 launched its first 𝐌𝐮𝐥𝐭𝐢𝐩𝐡𝐲𝐬𝐢𝐜𝐬 𝐅𝐮𝐬𝐢𝐨𝐧 solutions for customer deployment.

➤ Platform combines Synopsys AI-powered EDA tools with 𝐀𝐧𝐬𝐲𝐬 golden signoff analysis.

➤ Solutions integrate multiphysics analysis across 𝐭𝐢𝐦𝐢𝐧𝐠, 𝐝𝐞𝐬𝐢𝐠𝐧 𝐜𝐥𝐨𝐬𝐮𝐫𝐞, 𝐦𝐮𝐥𝐭𝐢-𝐝𝐢𝐞, and 𝐚𝐧𝐚𝐥𝐨𝐠 workflows.

➤ Multiphysics Fusion for Timing Signoff enables 𝐮𝐩 𝐭𝐨 𝟑𝐱 faster runtimes with SPICE-accurate analysis.

➤ Design Closure solution delivers 𝐮𝐩 𝐭𝐨 𝟏𝟎𝐱 faster closure and improved PPA.

➤ Multi-die solution provides concurrent 𝐩𝐨𝐰𝐞𝐫, 𝐭𝐡𝐞𝐫𝐦𝐚𝐥, and 𝐞𝐥𝐞𝐜𝐭𝐫𝐨𝐦𝐚𝐠𝐧𝐞𝐭𝐢𝐜 analysis.

➤ Platform uses 𝐍𝐕𝐈𝐃𝐈𝐀 CUDA-X libraries and GPU acceleration for complex workloads.

➤ Market leaders including 𝐂𝐢𝐬𝐜𝐨, 𝐌𝐞𝐝𝐢𝐚𝐓𝐞𝐤, 𝐍𝐕𝐈𝐃𝐈𝐀, and 𝐒𝐚𝐦𝐬𝐮𝐧𝐠 validated the technology.

➤ Synopsys said the platform helps shift chip development from 𝐨𝐯𝐞𝐫𝐝𝐞𝐬𝐢𝐠𝐧 to 𝐜𝐨-𝐝𝐞𝐬𝐢𝐠𝐧.

👉 𝐖𝐡𝐲 𝐈𝐭 𝐌𝐚𝐭𝐭𝐞𝐫𝐬:

➤ Growing AI and HPC chip complexity increases demand for 𝐦𝐮𝐥𝐭𝐢𝐩𝐡𝐲𝐬𝐢𝐜𝐬-𝐚𝐰𝐚𝐫𝐞 design tools.

➤ Faster design closure can reduce development costs and 𝐭𝐢𝐦𝐞-𝐭𝐨-𝐦𝐚𝐫𝐤𝐞𝐭.

➤ Early system-level insights may improve chip 𝐩𝐞𝐫𝐟𝐨𝐫𝐦𝐚𝐧𝐜𝐞, 𝐞𝐟𝐟𝐢𝐜𝐢𝐞𝐧𝐜𝐲, and reliability.

👉 𝐄𝐱𝐩𝐞𝐫𝐭 𝐒𝐭𝐚𝐭𝐞𝐦𝐞𝐧𝐭:

➤ "Multiphysics is fundamentally reshaping how advanced semiconductor designs are engineered, driving a shift from costly overdesign to integrated, system-aware co-design. Our Multiphysics Fusion portfolio unifies Synopsys and Ansys technologies to embed physics directly into digital and analog workflows, enabling engineering teams to design across domains with fewer iterations, improved productivity and more optimized silicon for next-generation systems." — 𝐒𝐚𝐧𝐣𝐚𝐲 𝐁𝐚𝐥𝐢, Senior Vice President of EDA Product Management and Strategy at Synopsys.

➤ "By unifying multiphysics analysis and timing signoff across digital, analog, photonic and multi-die designs, Synopsys Multiphysics Fusion technology gives us earlier insight into cross-domain interactions across silicon, advanced packaging and optical domains, which makes it possible for us to improve predictability, reduce late-stage rework, and achieve a runtime that's 10 times faster than before." — 𝐇𝐚𝐫𝐫𝐢𝐬𝐨𝐧 𝐇𝐬𝐢𝐞𝐡, Vice President at MediaTek.

➤ "Synopsys is using NVIDIA accelerated computing and CUDA-X libraries, including cuDSS, which delivers up to 13x GPU acceleration, to scale increasingly complex SPICE simulations, electromagnetics, and power-integrity workloads. In addition, Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs." — 𝐓𝐢𝐦 𝐂𝐨𝐬𝐭𝐚, Vice President and General Manager of Computational Engineering at NVIDIA.

➤ "Synopsys' Multiphysics Fusion technology provides a unified, all-aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. This is increasingly important as we pursue higher levels of integration, performance, and reliability across advanced process and multi-die technologies." — 𝐇𝐲𝐮𝐧𝐠-𝐎𝐜𝐤 𝐊𝐢𝐦, Vice President and Head of the Foundry Design Technology Team at Samsung Electronics.