Hardik Shah
2026.06.18 20:45

๐Ÿ“ข ๐‰๐”๐’๐“ ๐ˆ๐: $Intel(INTC.US) Intel Appoints Seok-Hee Lee as EVP of Intel Foundry

๐Ÿ‘‰ ๐Š๐ž๐ฒ ๐‡๐ข๐ ๐ก๐ฅ๐ข๐ ๐ก๐ญ๐ฌ:

โžค ๐ˆ๐ง๐ญ๐ž๐ฅ appointed ๐’๐ž๐จ๐ค-๐‡๐ž๐ž ๐‹๐ž๐ž as Executive Vice President of Intel Foundry.

โžค Lee will oversee ๐š๐๐ฏ๐š๐ง๐œ๐ž๐ ๐ฉ๐š๐œ๐ค๐š๐ ๐ข๐ง๐ , system integration, and back-end manufacturing.

โžค Lee will report directly to Intel CEO ๐‹๐ข๐ฉ-๐๐ฎ ๐“๐š๐ง.

โžค He joins Intel from ๐’๐Š ๐Ž๐ง, where he served as President and CEO.

โžค Lee previously led ๐’๐Š ๐ก๐ฒ๐ง๐ข๐ฑ and held engineering leadership roles at Intel.

โžค Intel plans to ramp advanced packaging technologies including ๐„๐Œ๐ˆ๐-๐“ and ๐‡๐๐ˆ.

โžค Intel is establishing ๐š๐๐ฏ๐š๐ง๐œ๐ž๐ ๐ฉ๐š๐œ๐ค๐š๐ ๐ข๐ง๐  as a separate business unit.

โžค ๐๐š๐ ๐š ๐‚๐ก๐š๐ง๐๐ซ๐š๐ฌ๐ž๐ค๐š๐ซ๐š๐ง will continue leading front-end technology and manufacturing.

โžค Chandrasekaran retains responsibility for ๐ˆ๐ง๐ญ๐ž๐ฅ ๐Ÿ๐Ÿ–๐€ and ๐ˆ๐ง๐ญ๐ž๐ฅ ๐Ÿ๐Ÿ’๐€ process ramps.

๐Ÿ‘‰ ๐–๐ก๐ฒ ๐ˆ๐ญ ๐Œ๐š๐ญ๐ญ๐ž๐ซ๐ฌ:

โžค Advanced packaging is becoming a key differentiator in ๐€๐ˆ and high-performance computing.

โžค Leadership changes support Intel's strategy to expand its ๐Ÿ๐จ๐ฎ๐ง๐๐ซ๐ฒ business.

โžค Dedicated packaging operations could accelerate commercialization of ๐ง๐ž๐ฑ๐ญ-๐ ๐ž๐ง chip technologies.

๐Ÿ‘‰ ๐„๐ฑ๐ฉ๐ž๐ซ๐ญ ๐’๐ญ๐š๐ญ๐ž๐ฆ๐ž๐ง๐ญ:

โžค "Seok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution." โ€” ๐‹๐ข๐ฉ-๐๐ฎ ๐“๐š๐ง, Chief Executive Officer of Intel.

โžค "He will focus on coupling logic, memory, networking, and other critical components for Intel Foundry customers, while helping ramp advanced packaging technologies including EMIB-T and HBI to high volume." โ€” ๐‹๐ข๐ฉ-๐๐ฎ ๐“๐š๐ง, Chief Executive Officer of Intel.

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