SK Hynix confirmed it will use Intel’s EMIB advanced packaging for next-gen HBM memory chips, joining Apple, MediaTek and other top TSMC clients in a win for Intel, media report, adding the victory is mainly due to the continued shortage of TSMC’s CoWoS capacity. $SK Hynix(SKHY.US) $Intel(INTC.US) $Taiwan Semiconductor(TSM.US) $Apple(AAPL.US) #semiconductors
Source: Dan Nystedt
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