TSMC: Demand for AI compute will 5x annually in coming years, leading overall system compute in 2029 to 50x that of 2024, media report, citing April Li, head of AI and HPC Business Development. TSMC estimates 30 to 40GW per year of AI data centers will be built per year, compared to 5 to 6GW of data centers historically. New advances are vital to keep pace, and TSMC aims to have A12 in mass production in 2029, and 14x-reticle size CoWoS packaging in 2028, and more. By 2030, a single AI chip package will hold over 1 trillion transistors, she said. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $Alphabet(GOOGL.US) $Broadcom(AVGO.US) #semiconductors
Source: Dan Nystedt
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