Bloomberg: China is considering launching an incentive plan of 200 billion to 500 billion yuan to provide subsidies and other financing support for the domestic chip manufacturing industry. Sources added that this plan will be independent of existing government funding programs, such as the 344 billion yuan "Big Fund Phase III" equity investment tool.
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
