
Traded Value$Intel(INTC.US)intel 宣称下一代存储技术,代替 HBM。创新点是用铜材料在芯片外围 Z 角封装堆叠,使用 intel 的 EMIB 封装技术。铜的散热性更好,相对 HBM 打孔凸出电阻更小,所以理论上可以比现在 HBM 堆的更多,功耗更小。
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