GTC in March may announce the new LPU chip, mainly used for inference, similar to ASIC chips. The PCB board used below is a high-layer-count board, with the M9 Q-bus scheme. Material upgrades are the general trend! The GTC conference will bring new catalysts, with PCB being a core beneficiary.

LPU Update

1) The current version is V3, with Samsung providing design service, and alphawave supplying serdes IP. The V3 demo rack is currently being designed for display at GTC. Subsequent updated versions are V3 Ultra paired with rubin ultra, and V4 paired with Feynman.

2) The V3 version's system design extensively adopts existing technology. A single rack contains 16 compute trays, each equipped with 16 LPUs, 2 high-end FPGAs, 1-2 CPUs, and a midplane board. The midplane connects to the compute board at the front end and a few copper cables at the back end. 8 racks are connected in series via an E/W network, forming a 2048-card system. The FPGAs are responsible for the configurable bypass communication function within the 2048-card system.

3) The V3U version is likely a consolidated packaging version of V3. The V4 version is currently considering using N3P process + CoWoS R to replace the A16 process, with overall cost being the main consideration. V3 communicates with GPU clusters via a scale-out network, responsible for the decode function of some models. V3U/V4 begins to consider co-existing with GPUs within the nvlink network.

Incremental benefits: PCB, FPGA, liquid cooling, copper cables, optical modules.

$TTM Tech(TTMI.US)$AMD(AMD.US)

$Vertiv(VRT.US)$Corning(GLW.US)$Tradr 2X Long Lite Daily ETF(LITX.US)$Lumentum(LITE.US)

My current holdings: litx Considering opening positions in other liquid cooling & glw.

Storage might see expected catalysts from Micron's earnings report on March 20.

Adjust some positions from Snxx to open new positions.