With Mr. Z's guidance and the responses from various experts in the comments section, we fed the information to Gemini for organization.

Based on current industry trends and technological advancements, we have organized these "supplies" into a complete AI infrastructure industry chain, following the logic from raw materials to the final computing power center.

The core logic of this chain is: Physical layer materials (scarce resources) → Core components (technical barriers) → Testing and equipment (yield guarantee) → Modules and servers (end integration).

1.6T/AI Industry Chain Panorama: From "Supplies" to "Battlefield"

First Layer: Physical Raw Materials (Upstream Source)

This is the "mine" at the bottom of the industry chain, directly determining the physical upper limit of production capacity.

Indium Phosphide (InP) Substrate: The skeleton of optical chips. 1.6T demand doubles, and the expansion cycle is long.

Core Targets: Beijing Tongmei, Yunnan Chihong Zinc & Germanium, Sumitomo Electric Industries.

Lithium Niobate Wafers: The carrier for Thin-Film Lithium Niobate (TFLN), crucial for achieving high-speed modulation.

Core Targets: Tiantong Co., Ltd., Nata Opto-electronic Material Co., Ltd.

Helium Gas: Protective gas for fiber drawing and chip etching, a non-renewable strategic resource.

Core Targets: Hangyang Co., Ltd., Jiufeng Energy Group Co., Ltd.

Magnetic Materials (TGG Crystals): Upstream material for manufacturing Faraday rotators.

Core Targets: Fujian Castech Crystals Inc.

Second Layer: Core Optical Components (Technological Heart)

This layer determines the performance and stability of optical modules.

High-Speed Chips (200G EML): Currently the most scarce segment.

Core Targets: Yuanjie Semiconductor Technology Co., Ltd., Broadcom, Lumentum.

Thin-Film Lithium Niobate Modulators: A disruptive solution for the 1.6T/3.2T era.

Core Targets: Guangku Technology Co., Ltd.

Passive Devices (Optical Isolators/Rotators): The "moat" for lasers.

Core Targets: TFC Optical Communication Co., Ltd., Tengjing Technology Co., Ltd.

High-Frequency PCBs and Micro-Drills: The highway for signal transmission. 1.6T requires PCBs to reach M8 level with extremely fine vias.

Core Targets: Dingtai High-Tech Co., Ltd. (Micro-Drills), Shennan Circuits Co., Ltd. (PCB leader), Wus Printed Circuit Co., Ltd.

Third Layer: Testing, Equipment, and Packaging (Yield Guardians)

As technological complexity increases, the value of testing grows exponentially.

HBM Testing Equipment: With the increase in HBM3e/HBM4 stacking layers, 3D testing becomes a necessity.

Core Targets: Wuhan Jingce Electronic Group Co., Ltd., Changchuan Technology, Saiteng Co., Ltd. (closely related to NVIDIA).

Optical Module/Chip Testing: Ensures each 1.6T module meets stringent computing power standards before leaving the factory.

Core Targets: Huafeng Measurement & Control, Changchuan Technology.

Laser Drilling Equipment: Used for ultra-precision processing of PCBs.

Core Targets: Han's CNC, Delong Laser.

Fourth Layer: System Integration (Computing Power Endpoint)

This is the sector you are most familiar with, and the endpoint where the "supplies" from the first three layers converge.

High-Speed Optical Modules: Zhongji Innolight, Eoptolink Technology Inc., Accelink Technologies Co., Ltd.

AI Servers/Switches: Foxconn Industrial Internet, Unisplendour Corporation (H3C).