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11 hours ago
MIC report with a supply/demand assessment on various AI components.
HBM/Commodity DRAM: tight through 20227-2028High-end MLCC: tight in 2027; 2028 to be watchedABF Substrate: may ease in 2028ABF Buildup Film: tight in 2027; may ease in 2028High-end CCL: tight in 2027; may ease in 2028T-Glass: possible turning point in H2'27NAND: may ease from late 2027 through 2028$Micron Tech(MU.US) $DRAM $EWY $DISK $Sandisk(SNDK.US)The copyright of this article belongs to the original author/organization.
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