Refond first launched a new diamond-based ultra-high power density packaging product

Zhitong
2025.02.19 00:50

According to Refond, in response to the pain points of traditional high-power packaging products, Refond has innovatively adopted diamond substrate technology and launched a groundbreaking new product in the industry - diamond-based ultra-high power density packaging, which meets the high-power LED usage requirements in scenarios such as automotive headlights, outdoor high-intensity lighting, and stage lighting, opening up more possibilities for the development and application of high-power LEDs