The advanced packaging in the semiconductor testing industry welcomes a great year, with strong orders for ASE, King Yuan Electronics, and Powertech

With the booming development of edge AI applications, the demand for packaging testing will continue to rise. Taiwanese manufacturers are actively deepening their advanced packaging technology, and it is expected that by 2030, the global semiconductor market will grow to one trillion dollars, with the packaging market growing at a rate of over 10% annually, reaching a scale of 90 billion dollars by 2030. Despite geopolitical influences reshaping the global packaging and testing landscape, Taiwanese manufacturers still demonstrate industry advantages, accelerating capacity layout and consolidating their packaging advantages in high-end chips such as AI and GPU