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name
Chipmore
688352.SH
Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program development, probe card/POGO PIN design and repair, and thin film flip chip tape design. Its packaging and testing products, include various display driver chips, power management chips, and RF front-end chips used for applications in televisions, smartphones, automotive electronics, smart wearables, electronic communications, and industrial control.
6.359 T
688352.SHMarket value -Rank by Market Cap -/-

Financial Score

10/12/2025 Update
C
SemiconductorsIndustry
Industry Ranking96/163
Industry medianC
Industry averageC
Score Analysis
Peer Comparison
  • Criteria
    Rating
  • Profit ScoreC
    • ROE4.50%C
    • Profit Margin12.66%B
    • Gross Margin31.83%C
  • Growth ScoreC
    • Revenue YoY11.02%B
    • Net Profit YoY-24.13%D
    • Total Assets YoY2.81%C
    • Net Assets YoY0.87%C
  • Cash ScoreB
    • Cash Flow Margin790.11%B
    • OCF YoY11.02%B
  • Operating ScoreD
    • Turnover0.3D
  • Debt ScoreA
    • Gearing Ratio17.51%A

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Institutional View & Shareholder

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    News
    View More

    The integrated circuit packaging and testing sector surged sharply, with Chipmore rising over 10%

    The integrated circuit packaging and testing sector surged, with Chipmore rising over 10%, followed by FHEC, V-Test, CHIPPACKING, UNION SEMICONDUCTOR (HEFEI), and WLCSP

    Zhitong·
    SH
    688352
    -0.16%
    SH
    688362
    -0.40%
    SH
    688372
    +2.50%
    Zhitong·
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    688352
    -0.16%
    SH
    688362
    -0.40%
    SH
    688372
    +2.50%

    Chipmore's application for issuing convertible bonds has been approved by the Shanghai Stock Exchange

    According to the Zhitong Finance APP, Chipmore announced that the Listing Review Committee of the Shanghai Stock Exchange held its 35th review meeting of 2025 on September 11, 2025 (referred to as the "meeting") to review the company's application for the issuance of convertible corporate bonds to unspecified objects. According to the results of the meeting, the company's application for the issuance of convertible corporate bonds to unspecified objects meets the issuance conditions, listing conditions, and information disclosure requirements

    Zhitong·
    SH
    688352
    -0.16%
    Zhitong·
    SH
    688352
    -0.16%

    Chipmore plans to repurchase company shares for 75 million to 150 million yuan

    According to the announcement from Chipmore, the company will repurchase a portion of its issued ordinary shares (A shares) through centralized bidding. The amount for the repurchased shares will be no less than RMB 75 million (inclusive) and no more than RMB 150 million (inclusive). The repurchase price will not exceed RMB 16.61 per share (including tax), and the repurchase period will be within 12 months from the date the company's board of directors approves this repurchase plan

    Zhitong·
    SH
    688352
    -0.16%
    Zhitong·
    SH
    688352
    -0.16%

    Companies on the Sci-Tech Innovation Board are clustering to disclose repurchase plans

    On June 18th, 8 companies listed on the STAR Market disclosed their repurchase plans, most of which were proposed by the company's chairman, actual controllers, or general managers. Based on the proposed maximum repurchase amounts, GDTC, Chipmore, and HWATSING plan to repurchase amounts exceeding 100 million yuan

    Zhitong·
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    688352
    -0.16%
    SH
    688120
    -0.32%
    SH
    688186
    -0.51%
    Zhitong·
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    688352
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    -0.32%
    SH
    688186
    -0.51%

    The advanced packaging in the semiconductor testing industry welcomes a great year, with strong orders for ASE, King Yuan Electronics, and Powertech

    With the booming development of edge AI applications, the demand for packaging testing will continue to rise. Taiwanese manufacturers are actively deepening their advanced packaging technology, and it is expected that by 2030, the global semiconductor market will grow to one trillion dollars, with the packaging market growing at a rate of over 10% annually, reaching a scale of 90 billion dollars by 2030. Despite geopolitical influences reshaping the global packaging and testing landscape, Taiwanese manufacturers still demonstrate industry advantages, accelerating capacity layout and consolidating their packaging advantages in high-end chips such as AI and GPU

    money.udn.com·
    SH
    600584
    +0.79%
    SH
    688352
    -0.16%
    US
    TSM
    +2.22%
    money.udn.com·
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    600584
    +0.79%
    SH
    688352
    -0.16%
    US
    TSM
    +2.22%
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