Awinic plans to issue convertible bonds to raise no more than 1.901 billion yuan for chip research and production, as well as the construction of a research and development center
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Awinic plans to issue convertible bonds to raise no more than 1.901 billion yuan, mainly for the construction of a global research and development center and multiple chip research and development and industrialization projects, including edge AI, automotive chips, and motion control chips
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