<p>HI SUN TECH (00818.HK) announced the formal establishment of an asset-backed special plan, with a total issuance scale of RMB 217 million, expected to mature on March 19, 2027. Among them, the senior tranche size is RMB 183 million, with a coupon rate of 2.8%; the subordinated tranche size is RMB 34 million, with the coupon rate to be determined</p>

00818

<p>HI SUN TECH announced the formal establishment of an asset-backed special plan, with a total issuance scale of 217 million RMB, expected to mature on March 19, 2027. Among them, the senior tranche size is 183 million RMB, with a coupon rate of 2.8%; the subordinated tranche size is 34 million RMB, with the coupon rate to be determined</p>

HI SUN TECH established an asset-backed special plan with a scale of 217 million RMB