Pan Asian Microvent: Plans to raise no more than 699 million yuan through a private placement

Pan Asian Microvent announced that it plans to raise no more than 699 million yuan through a private placement. After deducting issuance costs, the funds will be used for the intelligent manufacturing technology transformation and expansion project of dew point controllers, the low dielectric loss FCCL flexible copper-clad laminate project, the research and development center construction project, and to supplement working capital