New Stock News | Panjie Electronics plans to list on the Hong Kong Stock Exchange, and the China Securities Regulatory Commission requires supplementary explanations regarding the specific plans for the company's share split and other matters

According to the Zhitong Finance APP, on October 31, the China Securities Regulatory Commission (CSRC) announced the "Supplementary Material Requirements for Overseas Issuance and Listing Filing (October 27, 2025 - October 31, 2025)." The International Department of the CSRC issued supplementary material requirements for 9 companies, among which it requested BanJie Electronics to provide additional explanations regarding the specific plans for the company's share split and other matters. It is reported that BanJie Electronics submitted its listing application to the Hong Kong Stock Exchange on September 5, 2025, with CICC and GUOTAI JUNAN I as its joint sponsors.

The CSRC requested BanJie Electronics to supplement the following matters and asked lawyers to verify and provide clear legal opinions:

1. Regarding equity changes: (1) Please explain the pricing and basis for the company's previous capital increases and equity transfers, whether the capital contributions have been fully paid, whether there are any unfulfilled capital contribution obligations, capital withdrawal, or defects in the method of contribution, and provide a clear conclusive opinion on the legality and compliance of the establishment and previous equity changes; (2) Please clarify whether there have been any instances of shareholding on behalf of others in the company's history, and if so, verify according to the relevant requirements of the "Guidelines for the Application of Regulatory Rules - Overseas Issuance and Listing No. 2."

2. Regarding shareholder situation: (1) Please clarify whether there are any private equity funds among the existing shareholders, and if so, whether they have registered with the Asset Management Association of China; (2) Please clarify whether there are any entities prohibited by laws and regulations from holding shares in the domestic entities that the shareholder Haifeng Investment penetrates through; (3) Please clarify the progress of the identification of state-owned shareholders in mixed-ownership reform funds; (4) Please clarify the reasonableness of the share price of newly added shareholders Guofeng within the last 12 months, the reasons for any discrepancies in share prices at the same time, and whether there are any abnormal situations regarding the share price.

3. Please clarify whether the participants in the company's equity incentive plan are employees of the company, whether there are external personnel involved, and provide a clear conclusive opinion on the fairness of the price of the implemented equity incentive plan and whether there is any transfer of benefits.

4. Regarding this issuance and listing and the "full circulation" plan: (1) Please clarify the specific plan for the company's share split and whether it affects the number of shares to be issued this time; (2) Please clarify whether the shares held by the shareholders participating in this "full circulation" are subject to pledge, freeze, or other rights defects.

According to the prospectus, BanJie Electronics is a global leader and pioneer in the field of wireless sensor SoC, dedicated to providing innovative sensor chips. According to a Frost & Sullivan report, based on revenue in 2024, BanJie Electronics is the third-largest automotive wireless sensor SoC company in the world and the largest in China.

BanJie Electronics is at the forefront of wireless and SoC technology in sensor chips. Given that wireless sensor SoC is a key growth engine in the automotive electronics field, BanJie Electronics has seized the first-mover advantage by mass-producing high-performance automotive-grade wireless sensor SoCs since 2018. With deep domain expertise and a scalable SoC platform, the company has successfully applied these innovative results to other high-growth verticals such as energy storage and industrial electronics since 2021, providing a new generation of functionalities in these fields with its wireless sensor SoCs