TIAN TU CAPITAL has been accepted for registration to issue no more than 300 million RMB in technology innovation bonds
According to a report from Economic Information Daily on the 4th, TIAN TU CAPITAL announced that it has received a notification letter from the China Interbank Market Dealers Association regarding the acceptance of its registration for the issuance of technology innovation bonds. The group can issue technology innovation bonds with a total principal amount not exceeding 300 million yuan, with a validity period of no more than two years from the date of acceptance of the registration notification letter. The group stated that the technology innovation bonds will be underwritten by GUOSEN SECURITIES as the lead underwriter and will be issued in batches during the validity period, with the lead underwriter for each batch to be determined before issuance. (wh)
According to a report from Economic Information Daily on the 4th, TIAN TU CAPITAL (01973) announced that it has received a notification letter from the China Interbank Market Dealers Association regarding the acceptance of its registration for the issuance of technology innovation bonds. The group can issue technology innovation bonds with a total principal amount not exceeding RMB 300 million, with a validity period not exceeding two years from the date of acceptance of the registration notification letter. The group stated that the technology innovation bonds will be underwritten by GUOSEN SECURITIES as the lead underwriter and will be issued in batches during the validity period, with the lead underwriter for each batch to be determined before issuance. (wh)
