ASMPT has obtained new orders for chip-to-substrate TCB

AASTOCKS
2025.12.03 03:28

ASMPT (00522.HK) announced that it has recently obtained new orders from an industry-leading wafer foundry customer through an outsourced semiconductor assembly and test (OSAT) partner, involving 19 units of thermal compression bonding (TCB) tools used for chip-to-substrate (C2S) applications.

The Group's CEO, Jensen Huang, stated that ASMPT is the exclusive supplier and preferred process standard provider for this customer in C2S TCB solutions. Driven by the development of AI and high-performance computing applications, the TCB market is undergoing transformation and rapid growth. The acquisition of this new order reflects the market's recognition of the Group's technology and capabilities

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