According to reports, Taiwan Semiconductor plans to transport manufacturing equipment to its factory in the United States starting next summer

According to a report by Nikkei Asia, Taiwan Semiconductor (TSM.US) plans to begin shipping manufacturing equipment to its second factory in Arizona, USA, in the summer of 2026, paving the way for mass production of 3-nanometer processes in 2027. The report indicates that relevant equipment will start arriving at the factory in the third quarter of next year.

The timeline aligns with the expectations of the group's president, Wei Zhejia, who hopes to advance the mass production of 3-nanometer chips by several quarters. The factory was originally planned to start production in 2028.

Industry insiders have stated that after the installation of the equipment in the wafer fab, it will take a year to complete certification for the production line and gradually increase capacity. The more advanced the wafer process, the longer it takes, as the production steps have increased to over 1,000, and a significant amount of work is required to transfer and validate the process to another facility