ASMPT received orders for 15 thermal press bonding machines, and the stock price once rose by over 4%
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ASMPT announced that it has received orders for 15 chip-to-substrate thermal compression bonding equipment from a leading chip foundry's major outsourced semiconductor packaging and testing partner, for advanced AI computing chips. Following this news, ASMPT's stock price rose by more than 4% at one point, currently reported at 77.15 yuan, up 3.8%. In addition, SK Hynix has ordered a batch of thermal compression bonding machines from ASMPT to support HBM4 production, with a total contract value of approximately 30 billion Korean won
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