
SK Hynix invests $13 billion to build a factory to address HBM shortage

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SK Hynix has invested nearly $13 billion to build an advanced packaging plant, aiming to seize the high ground in high-bandwidth memory (HBM) during the AI era. The facility is located in Cheongju, South Korea, focusing on enhancing chip efficiency through high-density integration technology to meet the surging order demand from AI giants like NVIDIA. Institutions expect the HBM market to have a compound annual growth rate exceeding 33% over the next five years, directly driving DRAM prices to rise by more than 50% quarterly
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