<div id="readability-page-1"><div><p><span>BE Semiconductor Industries (BESI) shares dropped 19.08% intraday in Amsterdam trading after a report suggested that memory chipmakers may delay adopting the company's hybrid bonding technology for high-bandwidth memory (HBM).</span></p><p><span>The selloff followed a report from South Korean technology outlet ZDNet Korea, which cited discussions among JEDEC members, including Samsung Electronics and SK Hynix, about raising the package thickness limit for next-generation high-bandwidth memory chips. According to the report, the current HBM4 standard sits at 775 micrometers, and industry participants are weighing a range of 825 to 900 micrometers or more for future generations, including HBM4E and HBM5, which may require 20-layer DRAM stacking.</span></p><p><span>Hybrid bonding is a key technology used to connect stacked semiconductor layers in advanced packaging, enabling higher performance and efficiency in AI-focused memory solutions. According to Degroof Petercam analyst Michael Roeg, relaxing the height standards could allow DRAM producers to continue using existing technologies longer before transitioning to hybrid bonding. During its February earnings call, CEO Richard Blickman said 2026 would be 'a very important year to understand the adoption of hybrid bonding for HBM stacking,' pointing to Samsung's recently shared roadmap as a key signal.</span></p></div></div>

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<p>BE Semiconductor Industries (BESI) shares fell 19.08% in Amsterdam after concerns arose regarding the adoption of its hybrid bonding technology for high-bandwidth memory (HBM). A report indicated that memory chipmakers, including Samsung and SK Hynix, are considering increasing the package thickness limit for future HBM standards, potentially delaying the transition to hybrid bonding. Analyst Michael Roeg noted that relaxing height standards could extend the use of existing technologies. CEO Richard Blickman highlighted 2026 as a crucial year for hybrid bonding adoption in HBM stacking.</p>

BE Semiconductor Falls on HBM Standard Change Concerns