Taiwan Semiconductor Plans to Start 3nm Chip Production in Japan in 2028

Taiwan Semiconductor has officially confirmed its plan to produce 3nm chips in Japan in 2028.On Tuesday, March 31, according to filings from Taiwan Semiconductor, its second plant in Japan will adopt 3nm advanced process technology, with a planned monthly capacity of 15,000 12-inch wafers.This plan was disclosed in February this year by Taiwan Semiconductor CEO C.C. Wei during a meeting with Japanese Prime Minister Sanae Takaichi, and the submission of these documents further formalizes the details.Taiwan Semiconductor established its Japanese subsidiary, "Japan Advanced Semiconductor Manufacturing" (JASM), in 2021. It initially received support from Sony Semiconductor Solutions Corporation, and subsequently, DENSO and Toyota Motor Corporation joined as minority shareholders.Strategic Shift from Mature to Advanced ProcessesPreviously, Taiwan Semiconductor's presence in Japan focused primarily on mature process technologies.According to the plans announced in 2024, the combined monthly capacity of Taiwan Semiconductor's first and second plants in Japan was 100,000 12-inch wafers, utilizing process nodes such as 40nm, 22/28nm, 12/16nm, and 6/7nm, with a total investment for both plants exceeding $20 billion.The release of this revised plan signifies that the technological positioning of the second plant has been adjusted. It has been upgraded from the originally planned mature process to the 3nm advanced process, aligning with Taiwan Semiconductor's recent global strategy to accelerate the deployment of advanced process capacity.Taiwan Semiconductor's first plant in Japan commenced mass production at the end of 2024 and is progressing smoothly. If the second plant starts production as planned in 2028.According to previous reports by Japanese media, the investment for the second plant in Japan will reach approximately $17 billion, though Taiwan Semiconductor has not yet disclosed specific figures.