India's 1st advanced 3D glass chip packaging unit to come up in Bhubaneswar
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Heterogeneous Integration Packaging Solutions Pvt Ltd has commenced work on India's first advanced 3D glass chip packaging unit in Bhubaneswar, with an investment of ₹1,943 crore. This project, part of the India Semiconductor Mission, aims to produce 50 million semiconductor units annually and create over 2,500 jobs. It focuses on advanced glass substrate packaging and 3D heterogeneous integration technologies, positioning Odisha as a hub for next-generation electronics manufacturing and reducing reliance on imports. The project is expected to enhance India's semiconductor ecosystem and support high-performance computing and AI advancements.
Source: Business Standard The copyright of this article belongs to the original author/organization.
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