As of June 3rd, 14:56, the chip ETF E Fund (516350) reported 1.733 yuan, an increase of 3.46%, with a transaction volume of 200 million yuan. The tracked index, the CSI Chip Industry Index (h30007), closed at 4422.22 points yesterday, with an increase of approximately 103% over the past year.
OmniVision Technologies rose by 9.00%, Montage Technology rose by 7.09%, Zhongwei Company rose by 1.14%, Unisoc rose by 1.13%, and SMIC rose by 1.09%.
On June 2nd, SK Group Chairman Choi Tae-won revealed in South Korea that SK Hynix plans to double its wafer production capacity within the next five years. Choi Tae-won predicts that the storage supply shortage caused by the proliferation of AI will last until 2030, and the new AI PCs released by Jensen Huang will also require large-capacity storage, making it difficult to alleviate the storage bottleneck in the short term. SK Hynix will actively raise funds to promote large-scale equipment investment, covering the entire chain including equipment, construction, land, and electricity. On the same day, Intel CEO Pat Gelsinger delivered a keynote speech at COMPUTEX 2026, stating that the CPU to GPU ratio in the Agentic AI era will shift to 1:1, with a significant increase in CPU demand. Gelsinger is implementing a flexible and pragmatic new manufacturing strategy, sending positive signals about deepening cooperation with TSMC, as the global chip manufacturing landscape continues to reshape.
KGI Securities pointed out that leading storage companies are accelerating the adoption of CBA processes, with SK Hynix's HBM4 already using TSMC's logic process, and Samsung's 10th generation V-NAND independently manufacturing peripheral circuits, confirming that the logic foundry model has become a realistic choice for leading storage companies. The outsourcing of logic wafers will create a huge demand for production capacity, and the logic wafer foundry at 28nm and below nodes may continue to be in short supply. Reflecting on TSMC's development history, the domestic wafer foundry industry is facing a historic strategic opportunity.
Related products: Chip ETF E Fund (516350), comprehensive fee rate 0.20%. Connecting funds: Chip ETF Connecting A (016919), Chip ETF Connecting C (016920).
Other products in the same sector include: Sci-Tech Chip ETF E Fund (589130), tracking the Shanghai Stock Exchange Sci-Tech Board Chip Index (000685), comprehensive fee rate 0.60%; Sci-Tech Chip Design ETF E Fund (589030), tracking the Shanghai Stock Exchange Sci-Tech Board Chip Design Index (950162), comprehensive fee rate 0.60%

INTC

04335

516350

07709

INTW

SK Hynix plans to double its production capacity within five years to address the storage shortage caused by AI. Affected by this positive news and the overall strength of the chip sector, the chip ETF E Fund rose by 3.46%. Intel's CEO proposed that in the Agentic AI era, the CPU to GPU ratio will shift to 1:1, continuing to reshape the global chip manufacturing landscape. Institutions believe that the demand for logic wafer outsourcing has surged, presenting strategic opportunities for the domestic foundry industry

- As of June 3, 2026, the chip ETF E Fund (516350) reached ¥1.733, up 3.46%, with a trading volume of ¥200 million.  
- SK Hynix plans to double wafer production capacity in the next five years, anticipating a storage supply shortage due to AI adoption lasting until 2030.  
- Meanwhile, Intel's CEO highlighted a significant increase in CPU demand, indicating a shift in chip manufacturing dynamics, while local foundries face historic opportunities.

同壁财经

Intel

INTEL-T

E Fund CSI Chip Industry ETF

XL2CSOPHYNIX

GraniteShares 2x Long INTC Daily ETF

OmniVision Group

Montage Technology

AMEC

GUOXIN MICRO

SMIC

Taiwan Semiconductor

E Fund SSE STAR Chip ETF

STAR Chip Index

E Fund SSE STAR Chip Design Thematic ETF

OMNIVISION

MONTAGE TECH

SMIC HK SDR 5to1

SK Hynix's five-year production capacity will double, extending the super cycle of memory chips, and the chip ETF E Fund is strengthening