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Event Tracking

Dec6
SMIC Applies for a Patent on Packaging Structure and Method
15:55
Report indicates Mainland China's IC design market share has surpassed Taiwan, benefiting local foundries like SMIC
03:07
SMIC Issues a Progress Announcement on Matters Concerning the Purchase of Assets and Connected Transactions
00:00
Dec5
Major semiconductor industry conference IEDM 2025 is about to take place
23:42
Zhongju Core: Company products are now stably supplied to SMIC, SK Hynix, and other enterprises
19:41
SMIC Shanghai applies for a patent related to planarization process compensation
14:51