Mitsubishi Electric Corp.

Intel $Intel(INTC.US) EMIB Supply Chain

Flip-Chip Assembly

Bumping

Powertech Technology $6239.TW

Amkor Technology $Amkor Tech(AMKR.US)

Die Bond

ASMPT $0522.HK

Kulicke & Soffa $Kulicke and Soffa(KLIC.US)

Laser Marking

E&R Engineering $8027.TWO

Plasma Cleaning

E&R Engineering $8027.TWO

EMIB Substrate

IC Substrate

Ibiden $4062.T

Unimicron $3037.TWO

AT&S $ATS(ATS.US).VI

Shinko

ABF Film Lamination

Ajinomoto $2802.T

Eternal Precision Mechanics $7795.TWO

Bridge Die Bond

Toray $3402.T

Electroplating

ASMPT NEXX

Laser via Drilling

Mitsubishi Electric $6503.T

Baking Oven

Group Up $6664.TWO

Other Components

Silicon Capacitor

AP Memory $6531.TW

Samsung Electro-Mechanics $009150.KS

Silicon Capacitor Foundry

Powerchip $6770.TW

United Microelectronics $United Microelectronics(UMC.US)

Winbond $2344.TW

Information derived from Nomura Securities, but I included couple names in the supply chain I believe they missed - AT&S, Ajinomoto