UNION SEMICONDUCTOR (HEFEI)

Union Semiconductor (Hefei) Co., Ltd. provides packaging and testing services for integrated circuits to display driver chip design companies in China and internationally. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, and electronic tags categories.