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China’s DRAM makers will double production capacity by 2030 led by CXMT, media report, citing Goldman Sachs. The report says China’s memory makers are focusing on 3D DRAM due to restrictions to their purchase of EUV lithography machines. $ASML(ASML.US) $SK Hynix(SKHY.US) $SSNLF $Micron Tech(MU.US) #semiconductors
Source: Dan Nystedt
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