AVGU
31.1765.72%
Broadcom and Taiwan’s Powertech will invest US$400 million on a joint venture plant in Singapore for high-end chip packaging substrates, media report, citing Powertech regulatory filings. Powertech developed Fan-Out Panel-Level-Packaging (FOPLP) for large-sized chips such as those used in AI data centers. It also counts AMD as a client for FOPLP. $Broadcom(AVGO.US) $AMD(AMD.US) #Powertech #Singapore
Source: Dan Nystedt
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