Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR (TWSE:2330) boosted guidance and capex on clearer multi‑year AI demand, ramping 3nm/2nm wafer starts and outsourcing CoWoS steps to OSATs while resuming full Kumamoto output and shipping AMD Venice CPUs for Helios servers.

Previous Week Recap

• 3nm Wafer Starts Hit 180k: TSMC (2330): analysts say 3nm wafer starts could hit ~180k/mo in early Q4 2026, 2nm rising to ~80–100k, pushing combined 2nm+3nm above ~260k; shares rose ~2.5% intraday GuruFocus
• Guidance Raised; AI Demand Visibility: Citi says Taiwan Semiconductor Manufacturing Co. (2330) raised guidance, boosted capex and gave clearer 2027 AI-demand visibility, signaling early-stage, multi-year AI infrastructure spending growth. Dow Jones Newswires
• CoWoS 2.5D Outsourced To OSATs: TSMC (2330) will outsource the Chip-on-Wafer step of CoWoS 2.5D packaging to OSATs like ASE to ease capacity limits from rising AI chip demand; other packaging steps stay in-house. Binance News
• Venice CPUs In Full Production: TSMC (2330) made AMD’s Venice CPUs for second‑gen Helios AI servers, now in full production with shipments due soon; servers also use AMD MI455X AI accelerators — relevant for traders. Reuters
• Kumamoto JASM Fab Fully Recovered: Taiwan Semiconductor (2330) says its Kumamoto JASM fab in Japan has fully recovered from disruptions and returned to full production, restoring normal operations at that site. Reuters
• TSMC Price Rise, Consolidation: TSMC (2330) rose modestly; price ~2.3% above 20-day and 4.4% above 100-day moving averages, ~1.6% below 50-day. RSI 51.5. Resistance ~477, support ~385.5. Price consolidating. Benzinga