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Advanced Semiconductor Engineering
ASX.US
ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It operates through Packaging, Testing, EMS, and Others segments. The company offers semiconductor packaging, interconnect materials production, front-end engineering testing, wafer probing, and final testing services, as well as integrated solutions for EMS (electronic manufacturing services) in relation to computing, peripherals, communications, industrial, automotive, and server applications. It also provides turnkey services, such as packaging, testing, and direct shipment of semiconductors to end users; wire bonding, including lead frame and substrate-based packages; advanced packages; heterogeneous integration; and other test-related services.
9.866 T
ASX.USMarket value -Rank by Market Cap -/-

Financial Score

05/12/2025 Update
B
SemiconductorsIndustry
Industry Ranking13/84
Industry medianC
Industry averageC
Score Analysis
Peer Comparison
  • Criteria
    Rating
  • Profit ScoreB
    • ROE11.26%B
    • Profit Margin5.60%C
    • Gross Margin17.13%D
  • Growth ScoreB
    • Revenue YoY7.33%B
    • Net Profit YoY9.57%C
    • Total Assets YoY22.15%A
    • Net Assets YoY6.24%B
  • Cash ScoreB
    • Cash Flow Margin1786.14%B
    • OCF YoY7.33%B
  • Operating ScoreB
    • Turnover0.81B
  • Debt ScoreD
    • Gearing Ratio59.70%D

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    News
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    ASE Technology announced 2 more expansion projects in Taiwan as it rushes to build advanced semiconductor packaging capacity to meet demand for AI chips, media report, spending NT$4.32 billion for lan.........

    Nvidia, Foxconn and ASE are among companies that have invested in Taiwan industrial parks this year, media report, adding the Bureau of Industrial Parks has won 166 investments worth NT$174.5 billion .........

    Powertech, Taiwan’s 2nd biggest OSAT chip packaging firm, bought a factory from AUO for NT$6.90 billion to speed up advanced semiconductor packaging production for AI, HPC, automotive chips, media rep.........

    Taiwan’s semiconductor industry output will hit NT$7.1 trillion (US$232 Bln) in 2026, up 10% from NT$6.5 trillion ($212 Bln) this year, media report, citing the Industrial Technology Research Institut..................

    ASE inked a deal with Analog Devices (ADI) to buy ADI’s Penang, Malyasia packaging plant as part of a long-term supply agreement, they said. ASE, the world’s biggest chip packaging/testing firm, will .........