Broadcom and Taiwan’s Powertech will invest US$400 million on a joint venture plant in Singapore for high-end chip packaging substrates, media report, citing Powertech regulatory filings. Powertech developed Fan-Out Panel-Level-Packaging (FOPLP) for large-sized chips such as those used in AI data centers. It also counts AMD as a client for FOPLP. $Broadcom(AVGO.US) $AMD(AMD.US) #Powertech #Singapore
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
