Intel’s EMIB-T advanced packaging costs 50% less than TSMC CoWoS, media report, adding EMIB-T will begin mass production…

Intel’s EMIB-T advanced packaging costs 50% less than TSMC CoWoS, media report, adding EMIB-T will begin mass production next year as yields now exceed 90% - though another report says a 50% substrate yield remains the bottleneck.

-EMIB-T has already won Intel at least one AI ASIC chip project from MediaTek (likely a Google TPU)

-Broadcom and Meta are now evaluating EMIB-T.

-Two Intel partners in Taiwan are rapidly expanding production: Powerchip as its exclusive silicon capacitor supplier, and UMC for silicon bridges.

-Taiwan’s Unimicron is the substate partner for EMIB-T.

-For Intel EMIB-T cost and yield data, Taiwan media cite Wccftech for Intel EMIB-T cost, yield data, and Wccftech cites X handle @imnotharsh $Intel(INTC.US) $United Microelectronics(UMC.US) $Alphabet(GOOGL.US) $Broadcom(AVGO.US) $Meta Platforms(META.US)

Source: Dan Nystedt