Winbond, Taiwan’s 2nd biggest DRAM maker, has moved up its timeline to expand production in Kaohsiung, (south) Taiwan, media report, kicking off expansion at both phase 2 and phase 3 of the fab at the same time, with clean room construction to begin in 2027 and equipment installed by 2029. $SSNLF $SK Hynix(SKHY.US) $Micron Tech(MU.US) #Winbond #NanyaTech #semiconductors
Source: Dan Nystedt
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