Qualcomm sees HBC (High Bandwidth Compute) coming to smartphones, XR and cars too in the future. HBC Gen 1 commercialization in 2027 and Gen 2 in 2028. Sees lots of interest from hyperscalers. Adopts system integratrator model with compute die from Qualcomm, TSMC manufacturing, DRAM from stacking from someone else. With HBC, Qualcomm claims 6x the bandwidth per watt of HBM designs.
Source: Sravan Kundojjala
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.