Intel at DB conference
- Upbeat on foundry and process node developments; 18A yields tracking ahead of targets; calls14A defect density curve the best since 22nm- Strong internal demand for 14A; increased confidence on 14A external engagements; 0.9 PDK in Oct- EMIB-T ramp from back half of ’27; multiple billions of dollars of EMIB per customer; lower capex and higher ROIC vs wafer business- Sees 40% GM and 30% OPM for advanced packaging; wafer business will also have similar margins and depends on 14A execution as the best in this business is now close to 70%Source: Sravan Kundojjala
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