Kioxia details its MSA-CBA design for ultra-high-density 3D NAND flash memory (BiCS Flash), using copper direct bonding …
Kioxia details its MSA-CBA design for ultra-high-density 3D NAND flash memory (BiCS Flash), using copper direct bonding to stack multiple 218-layer cell array wafers onto a CMOS wafer. The technology offers a path to 1,000+ layers. Prototype devices have also demonstrated successful QLC (4 bits/cell) operation and high-temperature data retention. #Kioxia $Sandisk(SNDK.US) $SSNLF $SK Hynix(SKHY.US) #semiconductors
Source: Dan Nystedt
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