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花街S姐

从 11.5 万到 22 万片:半导体先进封装产业调研报告

先进封装已从单纯的后段制造环节,跃升为决定 AI 算力供给节奏的核心瓶颈。本报告基于对台积电(TSMC)CoWoS、SoIC、WMCM 等先进封装路线的产能调研,以及英伟达、AMD、谷歌、AWS、博通、联发科等主要 AI 芯片客户的需求结构分析,得出以下核心判断:第一,CoWoS 产能在 2026—2028 年将进入新一轮加速扩张周期...

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