<p>，/PRNewswire/ -- 随着全球智能手机销售趋于平稳，高通和联发科将其长期竞争带入快速增长的云 AI ASIC 市场。DIGITIMES Research 估计，联发科在 2024 年控制了 37% 的智能手机应用处理器市场，领先于高通的 27%。两家供应商的出货量合计超过 60%。由于手机增长预计将停滞在低个位数，两家公司正转向云计算芯片作为新的扩展来源。</p>
<p><strong>在 COMPUTEX 上揭示的云战略</strong></p>
<p>继续阅读</p>
<p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null"/></p>
<p>来源：DIGITIMES</p>
<p>高通和联发科概述了云 AI 芯片的新战略，并确认计划加入 Nvidia 的 NVLink Fusion 联盟，表明他们打算与高性能计算领域的现有企业竞争。这些举措在 2025 年 COMPUTEX 上宣布，突显了芯片制造商在 AI 基础设施中争夺优势的紧迫性，其中高性能计算 SoC 设计、SerDes 互连和先进制造节点的专业知识至关重要。</p>
<p><strong>联发科专注于速度和合作伙伴关系</strong></p>
<p>DIGITIMES Research 分析师 Joyce Chen 表示，联发科的竞争优势在于速度。该公司依赖 Arm 参考设计和台积电的先进节点，在智能手机和 Chromebook 中积累了大规模生产的专业知识。它还加入了 Nvidia 的 DGX Spark GB10 项目，并与谷歌在 TPU 开发上合作，加速其向云 AI ASIC 的推进。联发科展示了 224G SerDes 技术，表明其内部互连的实力，并通过与 Nvidia 和谷歌的联盟获得了先发优势。</p>
<p><strong>高通强调深度和整合</strong></p>
<p>高通采取了不同的路径，专注于更深的整合。自 2021 年收购 Nuvia 以来，该公司已将其 Oryon CPU 构建为其专有 IP 组合的基石。其在 2025 年收购 Alphawave 填补了 SerDes 和高速互连的空白，创建了更完整的技术栈。高通还与台积电和三星保持双重代工选择，增强了生产灵活性。其 Cloud AI 100 和 Ultra AI 加速卡已在边缘推理服务器中部署，并正在为大型语言模型的训练和推理准备芯片。</p>
<p><strong>可能重塑 AI ASIC 竞争的对抗</strong></p>
<p>Chen 表示，两家公司现在都有能力在云 AI ASIC 市场竞争。联发科的速度使其获得了早期优势，而高通则通过收购强化了其技术基础。Chen 指出，结果将取决于每家公司如何管理成本、满足对计算能力日益增长的需求、确保先进的制造能力以及与云服务提供商建立合作伙伴关系。她补充说，可以肯定的是，高通和联发科正在将他们的竞争扩展到智能手机之外，进入云 AI 芯片领域——这场竞争可能有助于定义人工智能硬件竞争的下一个时代。</p>
<p>来源：DIGITIMES ASIA</p>
<p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUwOTI1Jk5ld3NJdGVtSWQ9SEs4MDk0MCZUcmFuc21pc3Npb25fSWQ9MjAyNTA5MjUyMjAwUFJfTkVXU19VU1BSX19fX19ISzgwOTQw?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUwOTI1Jk5ld3NJdGVtSWQ9SEs4MDk0MCZUcmFuc21pc3Npb25fSWQ9MjAyNTA5MjUyMjAwUFJfTkVXU19VU1BSX19fX19ISzgwOTQw"/></p>

联发科

<p>高通和联发科正在将他们的竞争扩展到云端人工智能 ASIC 市场，因为全球智能手机销售停滞不前。联发科在智能手机应用处理器市场占有 37% 的份额，而高通则占有 27%。两家公司都加入了英伟达的 NVLink Fusion 联盟，以增强他们的云端人工智能芯片战略。联发科专注于速度和合作伙伴关系，利用 Arm 设计和台积电的先进工艺节点，而高通则强调集成，并通过收购加强了其技术。他们在云端人工智能领域的竞争可能会重塑人工智能硬件的未来</p>

<p>, /PRNewswire/ -- With global smartphone sales leveling off, Qualcomm and MediaTek are taking their long-running rivalry into the fast-growing cloud AI ASIC market. DIGITIMES Research estimates MediaTek controlled 37% of the smartphone application processor market in 2024, ahead of Qualcomm at 27%. Together, the two suppliers accounted for more than 60% of shipments. With handset growth expected to remain stuck in the low single digits, both companies are turning to cloud computing chips as a new source of expansion.</p>
<div class="lb-trans"><p>，/PRNewswire/ -- 随着全球智能手机销售趋于平稳，高通和联发科将其长期竞争带入快速增长的云 AI ASIC 市场。DIGITIMES Research 估计，联发科在 2024 年控制了 37% 的智能手机应用处理器市场，领先于高通的 27%。两家供应商的出货量合计超过 60%。由于手机增长预计将停滞在低个位数，两家公司正转向云计算芯片作为新的扩展来源。</p>
</div><p><strong>Cloud strategies unveiled at COMPUTEX</strong></p>
<div class="lb-trans"><p><strong>在 COMPUTEX 上揭示的云战略</strong></p>
</div><p>Continue Reading</p>
<div class="lb-trans"><p>继续阅读</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null" alt="" original-src="https://www.prnewswire.com/news-releases/null"/></p>
<p>Credit: DIGITIMES</p>
<div class="lb-trans"><p>来源：DIGITIMES</p>
</div><p>Qualcomm and MediaTek outlined new strategies for cloud AI chips and confirmed plans to join Nvidia's NVLink Fusion consortium, signaling their intent to take on incumbents in high-performance computing. The moves, announced at COMPUTEX 2025, underscore how chipmakers are racing to secure an edge in AI infrastructure, where expertise in HPC SoC design, SerDes interconnects, and advanced manufacturing nodes is critical to compete.</p>
<div class="lb-trans"><p>高通和联发科概述了云 AI 芯片的新战略，并确认计划加入 Nvidia 的 NVLink Fusion 联盟，表明他们打算与高性能计算领域的现有企业竞争。这些举措在 2025 年 COMPUTEX 上宣布，突显了芯片制造商在 AI 基础设施中争夺优势的紧迫性，其中高性能计算 SoC 设计、SerDes 互连和先进制造节点的专业知识至关重要。</p>
</div><p><strong>MediaTek focuses on speed and partnerships</strong></p>
<div class="lb-trans"><p><strong>联发科专注于速度和合作伙伴关系</strong></p>
</div><p>DIGITIMES Research analyst Joyce Chen said MediaTek's competitive edge lies in speed. The company has relied on Arm reference designs and TSMC's advanced nodes, building up mass-production know-how in smartphones and Chromebooks. It has also joined Nvidia's DGX Spark GB10 project and partnered with Google on TPU development, accelerating its push into cloud AI ASICs. MediaTek has demonstrated 224G SerDes technology, signaling its in-house interconnect strength and giving it a first-mover advantage through alliances with Nvidia and Google.</p>
<div class="lb-trans"><p>DIGITIMES Research 分析师 Joyce Chen 表示，联发科的竞争优势在于速度。该公司依赖 Arm 参考设计和台积电的先进节点，在智能手机和 Chromebook 中积累了大规模生产的专业知识。它还加入了 Nvidia 的 DGX Spark GB10 项目，并与谷歌在 TPU 开发上合作，加速其向云 AI ASIC 的推进。联发科展示了 224G SerDes 技术，表明其内部互连的实力，并通过与 Nvidia 和谷歌的联盟获得了先发优势。</p>
</div><p><strong>Qualcomm emphasizes depth and integration</strong></p>
<div class="lb-trans"><p><strong>高通强调深度和整合</strong></p>
</div><p>Qualcomm is taking a different path, focusing on deeper integration. Since acquiring Nuvia in 2021, the company has built its Oryon CPU into a cornerstone of its proprietary IP portfolio. Its 2025 acquisition of Alphawave filled gaps in SerDes and high-speed interconnects, creating a more complete technology stack. Qualcomm also maintains dual foundry options with TSMC and Samsung, enhancing production flexibility. Its Cloud AI 100 and Ultra AI accelerator cards are already deployed in edge inference servers, and it is preparing chips designed for large language model training and inference.</p>
<div class="lb-trans"><p>高通采取了不同的路径，专注于更深的整合。自 2021 年收购 Nuvia 以来，该公司已将其 Oryon CPU 构建为其专有 IP 组合的基石。其在 2025 年收购 Alphawave 填补了 SerDes 和高速互连的空白，创建了更完整的技术栈。高通还与台积电和三星保持双重代工选择，增强了生产灵活性。其 Cloud AI 100 和 Ultra AI 加速卡已在边缘推理服务器中部署，并正在为大型语言模型的训练和推理准备芯片。</p>
</div><p><strong>Rivalry that could reshape AI ASIC competition</strong></p>
<div class="lb-trans"><p><strong>可能重塑 AI ASIC 竞争的对抗</strong></p>
</div><p>Chen said both companies now have the capacity to compete in the cloud AI ASIC market. MediaTek's speed gives it an early edge, while Qualcomm has reinforced its technology base through acquisitions. The outcome, Chen noted, will hinge on how well each can manage costs, meet rising demand for computing power, secure advanced manufacturing capacity, and forge partnerships with cloud providers. What is certain, she added, is that Qualcomm and MediaTek are carrying their rivalry beyond smartphones and into cloud AI chips — a contest that could help define the next era of competition in artificial intelligence hardware.</p>
<div class="lb-trans"><p>Chen 表示，两家公司现在都有能力在云 AI ASIC 市场竞争。联发科的速度使其获得了早期优势，而高通则通过收购强化了其技术基础。Chen 指出，结果将取决于每家公司如何管理成本、满足对计算能力日益增长的需求、确保先进的制造能力以及与云服务提供商建立合作伙伴关系。她补充说，可以肯定的是，高通和联发科正在将他们的竞争扩展到智能手机之外，进入云 AI 芯片领域——这场竞争可能有助于定义人工智能硬件竞争的下一个时代。</p>
</div><p>SOURCE DIGITIMES ASIA</p>
<div class="lb-trans"><p>来源：DIGITIMES ASIA</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUwOTI1Jk5ld3NJdGVtSWQ9SEs4MDk0MCZUcmFuc21pc3Npb25fSWQ9MjAyNTA5MjUyMjAwUFJfTkVXU19VU1BSX19fX19ISzgwOTQw" alt="" original-src="https://rt.prnewswire.com/rt.gif?NewsItemId=HK80940&amp;Transmission_Id=202509252200PR_NEWS_USPR_____HK80940&amp;DateId=20250925"/></p>

DIGITIMES 亚洲科技论坛 2025：高通和联发科在 AI 芯片领域将智能手机竞争扩展至云端