<div id="readability-page-1">— DIC’s booth will showcase prototypes of three products that transcend the traditional constraints of chemicals manufacturing — TOKYO--(BUSINESS WIRE)-- DIC Corporation ( DICCF ) announced today that it will participate in CES 2026, one of the world’s leading technology trade shows for the consumer electronics industry, which will be held from January 6 to 9, 2026, in Las Vegas, in the U.S. state of Nevada. DIC has chosen “Signals” as the theme of its exhibit and will showcase prototypes of three innovative products that embody its “Direct to Society” business creation mechanism, which aims to transcend the traditional constraints of chemicals manufacturing to deliver value directly to society. This will be the second consecutive year that the Company has taken part in this important event. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251205218097/en/ With the rapid evolution of communications technologies and AI, chemicals companies—who play a key role in supporting social infrastructure—are also on the threshold of dramatic change. Guided by its Direct to Society mechanism, DIC is striving to create an ecosystem of diverse new businesses that overlap conventional industry and sector boundaries. This mechanism emphasizes looking directly to society to actively envisage future needs and to respond with appropriate solutions and value. DIC participated in CES 2025 in January 2025, where it first introduced its new HAGAMOSphere® omnidirectional multicopter prototype. Garnering praise from judges for its innovative design and engineering features, the prototype earned DIC designation as a CES Innovation Awards® 2025 Honoree in the Drones category. HAGAMOSphere also attracted considerable attention from engineers, as well as from individuals in marketing and creative fields, from around the world, and from the media. In 2026, DIC will unveil prototypes of three products—including a new, advanced model of HAGAMOSphere—that exemplify the tremendous potential of its new businesses and innovations. This will be the first time that HAGAMOSphere 2.0 is exhibited anywhere in the world, and the first time that MoR™ and Tacthancer™ are exhibited outside of Japan. By participating in CES 2026, DIC aims to promote its technologies and solutions across a broad range of industries, discover potential business partners and propose new value. Overview of the Prototypes to Be Exhibited 1. MoR™ -multifunctional robotic finger This innovative robotic finger recognize and grasp objects without the need for built-in cameras or external sensors. Sensor functions are incorporated into the curved surface of the finger using 3D molded interconnect device (3D-MID) technology, allowing it to directly detect the shape of objects ranging from soft food items to hard metal parts, and to automatically pick them up with the appropriate grip. MoR enables sensing and operation in environments not previously conducive to the use of robotic fingers, underscoring expectations that it will find application in a broad range of fields, including manufacturing such as food and semiconductors, and laboratory automation. 2. HAGAMOSphere® 2.0 next-generation -omnidirectional multicopter This next-generation, innovative omnidirectional multicopter is an updated version of the original HAGAMOSphere which earned DIC designation as a CES Innovation Awards 2025 Honoree in advance of CES 2025. While maintaining the unique structure of its predecessor, which equips it to both fly and roll on the ground, HAGAMOSphere 2.0 was designed to withstand even harsher environments. The aim of this update is to enable multiple operational modes, allowing it to withstand stronger winds, travel over rough terrain, and carry a high payload, by using tilt-rotor system. DIC will continue to enhance the capabilities of this drone to facilitate its adoption for uses that help address social issues, including the collection of information at disaster sites, infrastructure inspection and weather observation. 3. Tacthancer™ -tactile sensitivity enhancer This tool employs a sensing technology that improves the ability of users to detect surface flaws that cannot be felt by human touch alone. Its simple design precludes the need for a power source. It can be worn on the hand to enhance an individual’s sense of touch, and can be combined with sensors to record sensing data on any anomalies detected. With its limitless potential for integration, Tacthancer is expected to unlock new possibilities for sensing applications. Exhibition details Name: CES 2026 Date and time: January 6–9, 2026 (Pacific Standard Time) Organizer: The Consumer Technology Association (CTA) Venue: Las Vegas Convention Center (Las Vegas, Nevada, United States) DIC’s booth: North Hall–8063 DIC’s exhibition page: https://www.dic-global.com/en/event/ces/index.html Dedicated SNS account (X): @dic_at_ces – Ends – About DIC Corporation ( DICCF ) DIC Corporation ( DICCF ) is one of the world’s leading fine chemicals companies and the core of the DIC Group, a multinational organization comprising over 170 companies, including Sun Chemical Corporation, across more than 60 countries and territories. The DIC Group is recognized as a global leader in the markets for various essential products, notably packaging materials, display materials for televisions and computers, and high-performance materials for smartphones, digital devices, and automobiles. Through these products, the Group endeavors to deliver safety, peace of mind, color and comfort, to people everywhere. The DIC Group is also committed to contributing to a sustainable society by developing innovative products that respond to social changes and address social imperatives. With annual consolidated net sales exceeding ¥1 trillion and over 21,000 employees worldwide, the Group pledges to continue working closely with its customer globally. Website: https://www.dic-global.com/en/ <img src="https://imageproxy.pbkrs.com/https://cts.businesswire.com/ct/CT/query-ZGlzdHJvPW54JmlkPWJ3bmV3cyZsYW5nPWVuJnNpZD1hY3FyOCZzdHk9MjAyNTEyMDUyMTgwOTdyMQ?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" original-src="https://imageproxy.pbkrs.com/https://cts.businesswire.com/ct/CT/query-ZGlzdHJvPW54JmlkPWJ3bmV3cyZsYW5nPWVuJnNpZD1hY3FyOCZzdHk9MjAyNTEyMDUyMTgwOTdyMQ"/>View source version on businesswire.com: https://www.businesswire.com/news/home/20251205218097/en/ Source: DIC Corporation ( DICCF )</div>

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DIC Corporation 将参加 2026 年拉斯维加斯的 CES 展会，展示以 “信号” 为主题的三款创新产品原型。这些产品包括 MoR™，一种多功能机器人手指；HAGAMOSphere® 2.0，一款下一代全向多旋翼无人机；以及 Tacthancer™，一种触觉敏感度增强器。DIC 旨在推广其技术，寻找商业合作伙伴，并在各个行业中提出新的价值。这是 DIC 连续第二年参加 CES，此前他们获得了 2025 年 CES 创新奖® 的荣誉

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