<p>, /PRNewswire/ -- <strong>根据 MarketsandMarkets™的报告，</strong> 全球混合键合市场预计将在 2032 年达到 6.339 亿美元，2025 年为 1.647 亿美元，2025 年至 2032 年期间的年均增长率为 21.2%。</p>
<p><strong>浏览 150 个市场数据表和 60 个图表，涵盖 250 页的详细目录，主题为&#34;</strong> <strong>混合键合市场 - 全球预测到 2032 年&#34;</strong></p>
<p><strong>混合键合市场</strong> <strong>规模与预测：</strong></p>
<ul>
<li><strong>可用市场规模年份：</strong> 2020–2032</li>
<li><strong>2025 年市场规模：</strong> 1.647 亿美元</li>
<li><strong>2032 年预计市场规模：</strong> 6.339 亿美元</li>
<li><strong>年均增长率（2025–2032）：</strong> 21.2%</li>
</ul>
<p><strong>混合键合市场</strong> <strong>趋势与洞察：</strong></p>
<ul>
<li>市场受到半导体行业向 3D 集成转型的推动，以克服规模限制，实现更高的带宽、更低的功耗和更精细的互连密度。芯片组、先进逻辑、内存堆叠和 CIS 设备的日益采用进一步加速了对超精确键合工艺的需求。</li>
<li>按包装架构，2025 年至 2032 年期间，芯片对芯片（D2D）预计将展现出 35.3% 的年均增长率。</li>
<li>按工艺流程，预计后端环节将在预测期内主导市场。</li>
<li>按设备类型，晶圆键合设备预计将在 2025 年至 2032 年期间展现出最高的年均增长率。</li>
<li>亚太地区的混合键合市场在 2024 年占据了 51.6% 的收入份额。</li>
</ul>
<p><strong>下载 PDF 手册：</strong> https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=2641237</p>
<p>混合键合市场受到半导体行业向 3D 集成转型的推动，以克服规模限制，实现更高的带宽、更低的延迟和更高的能效。AI、高性能计算（HPC）和先进逻辑设备中芯片组架构的日益采用加速了对超细间距互连的需求。内存堆叠和 CIS 制造进一步推动了对高精度键合技术的需求。晶圆厂和 IDM 在先进封装能力上的大量投资，加上计量、等离子体激活和表面准备的改进，增强了市场的动力。整体向更小、更快和更节能设备的推动继续加强全球混合键合的采用。</p>
<p><strong>晶圆键合设备在 2024 年占据了最大的市场份额</strong></p>
<p>晶圆键合设备在 2024 年占据了混合键合市场的最大份额，因为晶圆对晶圆（W2W）混合键合提供了最高的对准精度、工艺一致性和产量，使其非常适合内存、CIS 和 3D 逻辑设备的大规模生产。它们在整个晶圆上提供一致的键合性能，显著提高了良率并减少了工艺变异性。随着领先的晶圆厂和内存制造厂扩大 3D 集成，晶圆键合设备仍然是支持这些扩展的基础设备类别。等离子体激活、对准光学和晶圆处理的持续进步进一步巩固了它们的主导地位。W2W 生产线的强大装机基础进一步巩固了它们作为主要键合技术的地位。</p>
<p><strong>异构集成领域预计将在 2025 年至 2032 年期间记录最高的年均增长率</strong></p>
<p>异构集成在预测期内预计将记录最高的年均增长率，因为行业迅速转向集成逻辑、内存、模拟、射频和加速器的芯片组架构。混合键合使得实现高带宽、低功耗和改善系统级性能所需的超密集垂直互连成为可能。这些多芯片组件中的 AI 加速器、高性能计算处理器和先进移动系统单芯片（SoC）越来越依赖于芯片组设计，显著加速了对异构集成的需求。混合不同工艺节点、材料和功能模块的能力提供了主要的成本和性能优势，推动了采用。随着系统级扩展变得至关重要，异构集成成为最具活力的增长领域。</p>
<p><strong>购买前咨询：</strong> https://www.marketsandmarkets.com/Enquiry_Before_BuyingNew.asp?id=2641237</p>
<p><strong>预计中国将在 2025 年占据全球混合键合市场的最大份额</strong></p>
<p>中国预计将在亚太地区和全球的混合键合行业中领先，原因在于其庞大的半导体制造规模、深度的供应链整合以及先进封装能力的持续扩展。该国正在大力投资于 3D 集成、晶圆级封装和国内设备开发，以减少对全球供应商的依赖，加速主要内存、CIS 和逻辑制造厂的混合键合采用。大型政府支持的项目和资金倡议进一步加强了向先进封装技术自给自足的推动。凭借高产量、来自消费电子和 AI 驱动应用的强劲需求，以及新制造厂和 OSAT 生产线的快速部署，中国被定位为塑造全球混合键合增长的主导力量。</p>
<p><strong>主要参与者</strong></p>
<p>在混合键合领域运营的主要公司包括 EV Group (EVG)（奥地利）、应用材料公司（美国）、SUSS MicroTec SE（德国）、Besi（荷兰）、Kulicke &amp; Soffa Industries, Inc.（新加坡）、东京电子（TEL）（日本）和 ASMPT（新加坡）等。</p>
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<p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUxMjExJk5ld3NJdGVtSWQ9SU80NDUxNiZUcmFuc21pc3Npb25fSWQ9MjAyNTEyMTExMDAxUFJfTkVXU19VU1BSX19fX19JTzQ0NTE2?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUxMjExJk5ld3NJdGVtSWQ9SU80NDUxNiZUcmFuc21pc3Npb25fSWQ9MjAyNTEyMTExMDAxUFJfTkVXU19VU1BSX19fX19JTzQ0NTE2"/></p>

应用材料

<p>全球混合键合市场预计将从 2025 年的 1.647 亿美元增长到 2032 年的 6.339 亿美元，年均增长率为 21.2%。这一增长受到半导体行业向 3D 集成和芯片架构采用的推动。亚太地区，特别是中国，预计将引领市场。主要参与者包括 EV Group、应用材料和 SUSS MicroTec。由于其高对准精度和产量，晶圆键合设备细分市场预计将占据主导地位</p>

<p>, /PRNewswire/ -- <strong>According to MarketsandMarkets™,</strong> the global Hybrid Bonding Market is projected to reach USD 633.9 million by 2032 from USD 164.7 million in 2025, registering a CAGR of 21.2% from 2025 to 2032.</p>
<div class="lb-trans"><p>, /PRNewswire/ -- <strong>根据 MarketsandMarkets™的报告，</strong> 全球混合键合市场预计将在 2032 年达到 6.339 亿美元，2025 年为 1.647 亿美元，2025 年至 2032 年期间的年均增长率为 21.2%。</p>
</div><p><strong>Browse 150 market data Tables and 60 Figures spread through 250 Pages and in-depth TOC on &#34;</strong> <strong>Hybrid Bonding Market - Global Forecast to 2032&#34;</strong></p>
<div class="lb-trans"><p><strong>浏览 150 个市场数据表和 60 个图表，涵盖 250 页的详细目录，主题为&#34;</strong> <strong>混合键合市场 - 全球预测到 2032 年&#34;</strong></p>
</div><p><strong>Hybrid Bonding Market</strong> <strong>Size &amp; Forecast:</strong></p>
<div class="lb-trans"><p><strong>混合键合市场</strong> <strong>规模与预测：</strong></p>
</div><ul>
<li><strong>Market Size Available for Years:</strong> 2020–2032</li>
<li><strong>2025 Market Size:</strong> USD 164.7 million</li>
<li><strong>2032 Projected Market Size:</strong> USD 633.9 million</li>
<li><strong>CAGR (2025–2032):</strong> 21.2%</li>
</ul>
<div class="lb-trans"><ul>
<li><strong>可用市场规模年份：</strong> 2020–2032</li>
<li><strong>2025 年市场规模：</strong> 1.647 亿美元</li>
<li><strong>2032 年预计市场规模：</strong> 6.339 亿美元</li>
<li><strong>年均增长率（2025–2032）：</strong> 21.2%</li>
</ul>
</div><p><strong>Hybrid Bonding Market</strong> <strong>Trends &amp; Insights:</strong></p>
<div class="lb-trans"><p><strong>混合键合市场</strong> <strong>趋势与洞察：</strong></p>
</div><ul>
<li>The market is driven by the semiconductor industry's shift toward 3D integration to overcome scaling limits and achieve higher bandwidth, lower power, and finer interconnect density. Rising adoption of chiplets, advanced logic, memory stacking, and CIS devices further accelerates the demand for ultra-precise bonding processes.</li>
<li>By Packaging Architecture, Die-to-die (D2D) to exhibit a CAGR of 35.3% between 2025 and 2032.</li>
<li>By process flow, the back-end segment is expected to dominate the market during the forecast period.</li>
<li>By equipment type, the wafer bonders segment is likely to exhibit the highest CAGR from 2025 to 2032.</li>
<li>The Asia Pacific hybrid bonding market accounted for a 51.6% revenue share in 2024.</li>
</ul>
<div class="lb-trans"><ul>
<li>市场受到半导体行业向 3D 集成转型的推动，以克服规模限制，实现更高的带宽、更低的功耗和更精细的互连密度。芯片组、先进逻辑、内存堆叠和 CIS 设备的日益采用进一步加速了对超精确键合工艺的需求。</li>
<li>按包装架构，2025 年至 2032 年期间，芯片对芯片（D2D）预计将展现出 35.3% 的年均增长率。</li>
<li>按工艺流程，预计后端环节将在预测期内主导市场。</li>
<li>按设备类型，晶圆键合设备预计将在 2025 年至 2032 年期间展现出最高的年均增长率。</li>
<li>亚太地区的混合键合市场在 2024 年占据了 51.6% 的收入份额。</li>
</ul>
</div><p><strong>Download PDF Brochure:</strong> https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=2641237</p>
<div class="lb-trans"><p><strong>下载 PDF 手册：</strong> https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=2641237</p>
</div><p>The hybrid bonding market is driven by the semiconductor industry's shift toward 3D integration to overcome scaling limitations and achieve higher bandwidth, lower latency, and improved power efficiency. The rising adoption of chiplet architectures in AI, HPC, and advanced logic devices accelerates the need for ultra-fine-pitch interconnects. Memory stacking and CIS manufacturing further propel the demand for high-precision bonding technologies. Substantial investments in advanced packaging capacity by foundries and IDMs, coupled with improvements in metrology, plasma activation, and surface preparation, reinforce market momentum. The overall push toward smaller, faster, and more energy-efficient devices continues to strengthen hybrid bonding adoption globally.</p>
<div class="lb-trans"><p>混合键合市场受到半导体行业向 3D 集成转型的推动，以克服规模限制，实现更高的带宽、更低的延迟和更高的能效。AI、高性能计算（HPC）和先进逻辑设备中芯片组架构的日益采用加速了对超细间距互连的需求。内存堆叠和 CIS 制造进一步推动了对高精度键合技术的需求。晶圆厂和 IDM 在先进封装能力上的大量投资，加上计量、等离子体激活和表面准备的改进，增强了市场的动力。整体向更小、更快和更节能设备的推动继续加强全球混合键合的采用。</p>
</div><p><strong>Wafer bonders segment captured the largest market share in 2024</strong></p>
<div class="lb-trans"><p><strong>晶圆键合设备在 2024 年占据了最大的市场份额</strong></p>
</div><p>Wafer bonders held the largest share of the hybrid bonding market in 2024 as wafer-to-wafer (W2W) hybrid bonding offers the highest alignment accuracy, process uniformity, and throughput, making it ideal for high-volume manufacturing of memory, CIS, and 3D logic devices. Their ability to deliver consistent bonding performance across full wafers significantly improves yield and reduces process variability. As leading foundries and memory fabs scale 3D integration, wafer bonders remain the foundational equipment category supporting these expansions. Continuous advancements in plasma activation, alignment optics, and wafer handling further strengthen their dominance. The strong installed base of W2W production lines reinforces their position as the primary bonding technology.</p>
<div class="lb-trans"><p>晶圆键合设备在 2024 年占据了混合键合市场的最大份额，因为晶圆对晶圆（W2W）混合键合提供了最高的对准精度、工艺一致性和产量，使其非常适合内存、CIS 和 3D 逻辑设备的大规模生产。它们在整个晶圆上提供一致的键合性能，显著提高了良率并减少了工艺变异性。随着领先的晶圆厂和内存制造厂扩大 3D 集成，晶圆键合设备仍然是支持这些扩展的基础设备类别。等离子体激活、对准光学和晶圆处理的持续进步进一步巩固了它们的主导地位。W2W 生产线的强大装机基础进一步巩固了它们作为主要键合技术的地位。</p>
</div><p><strong>Heterogeneous integration segment is expected to record the highest CAGR from 2025 to 2032</strong></p>
<div class="lb-trans"><p><strong>异构集成领域预计将在 2025 年至 2032 年期间记录最高的年均增长率</strong></p>
</div><p>Heterogeneous integration is likely to record the highest CAGR during the forecast period as the industry rapidly transitions to chiplet-based architectures that integrate logic, memory, analog, RF, and accelerators within a single package. Hybrid bonding enables the ultra-dense vertical interconnects required to achieve high bandwidth, low power consumption, and improved system-level performance in these multi-die assemblies. AI accelerators, HPC processors, and advanced mobile SoCs increasingly rely on chiplet designs, significantly accelerating demand for heterogeneous integration. The ability to mix different process nodes, materials, and functional blocks provides major cost and performance advantages, driving the adoption. As system-level scaling becomes critical, heterogeneous integration emerges as the most dynamic growth segment.</p>
<div class="lb-trans"><p>异构集成在预测期内预计将记录最高的年均增长率，因为行业迅速转向集成逻辑、内存、模拟、射频和加速器的芯片组架构。混合键合使得实现高带宽、低功耗和改善系统级性能所需的超密集垂直互连成为可能。这些多芯片组件中的 AI 加速器、高性能计算处理器和先进移动系统单芯片（SoC）越来越依赖于芯片组设计，显著加速了对异构集成的需求。混合不同工艺节点、材料和功能模块的能力提供了主要的成本和性能优势，推动了采用。随着系统级扩展变得至关重要，异构集成成为最具活力的增长领域。</p>
</div><p><strong>Inquiry Before Buying:</strong> https://www.marketsandmarkets.com/Enquiry_Before_BuyingNew.asp?id=2641237</p>
<div class="lb-trans"><p><strong>购买前咨询：</strong> https://www.marketsandmarkets.com/Enquiry_Before_BuyingNew.asp?id=2641237</p>
</div><p><strong>China is anticipated to hold the largest share of the global hybrid bonding market in 2025</strong></p>
<div class="lb-trans"><p><strong>预计中国将在 2025 年占据全球混合键合市场的最大份额</strong></p>
</div><p>China is expected to lead the hybrid bonding industry in Asia Pacific and globally due to its massive semiconductor manufacturing scale, deep supply-chain integration, and continuous expansion of advanced packaging capabilities. The country is investing heavily in 3D integration, wafer-level packaging, and domestic equipment development to reduce reliance on global suppliers, accelerating hybrid bonding adoption across major memory, CIS, and logic fabs. Large government-backed programs and funding initiatives further strengthen the push toward self-sufficiency in advanced packaging technologies. With high-volume production, strong demand from consumer electronics and AI-driven applications, and rapid deployment of new fabs and OSAT lines, China is positioned as the dominant force shaping global hybrid bonding growth.</p>
<div class="lb-trans"><p>中国预计将在亚太地区和全球的混合键合行业中领先，原因在于其庞大的半导体制造规模、深度的供应链整合以及先进封装能力的持续扩展。该国正在大力投资于 3D 集成、晶圆级封装和国内设备开发，以减少对全球供应商的依赖，加速主要内存、CIS 和逻辑制造厂的混合键合采用。大型政府支持的项目和资金倡议进一步加强了向先进封装技术自给自足的推动。凭借高产量、来自消费电子和 AI 驱动应用的强劲需求，以及新制造厂和 OSAT 生产线的快速部署，中国被定位为塑造全球混合键合增长的主导力量。</p>
</div><p><strong>Key Players</strong></p>
<div class="lb-trans"><p><strong>主要参与者</strong></p>
</div><p>Key companies operating in the hybrid bonding companies include EV Group (EVG) (Austria), Applied Materials, Inc. (US), SUSS MicroTec SE (Germany), Besi (Netherlands), Kulicke &amp; Soffa Industries, Inc. (Singapore), Tokyo Electron (TEL) (Japan), and ASMPT (Singapore), among others.</p>
<div class="lb-trans"><p>在混合键合领域运营的主要公司包括 EV Group (EVG)（奥地利）、应用材料公司（美国）、SUSS MicroTec SE（德国）、Besi（荷兰）、Kulicke &amp; Soffa Industries, Inc.（新加坡）、东京电子（TEL）（日本）和 ASMPT（新加坡）等。</p>
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<div class="lb-trans"><p><strong>此报告可享受 10% 的免费定制：</strong> https://www.marketsandmarkets.com/requestCustomizationNew.asp?id=2641237</p>
</div><p><strong>Browse Adjacent Market:</strong> Semiconductor and Electronics Market Research Reports &amp;Consulting</p>
<div class="lb-trans"><p><strong>浏览相关市场：</strong> 半导体和电子市场研究报告与咨询</p>
</div><p><strong>See More Latest Semiconductor Reports:</strong></p>
<div class="lb-trans"><p><strong>查看更多最新的半导体报告：</strong></p>
</div><p>Gas Sensor Market By Gas Type (Oxygen, Carbon Monoxide, Carbon Dioxide, Volatile Organic Compounds, Hydrocarbons), Technology (Electrochemical, Infrared, Solid-State/Metal-Oxide-Semiconductors), Output Type, Connectivity- Global Forecast to 2033</p>
<div class="lb-trans"><p>气体传感器市场按气体类型（氧气、一氧化碳、二氧化碳、挥发性有机化合物、碳氢化合物）、技术（电化学、红外、固态/金属氧化物半导体）、输出类型、连接性 - 全球预测到 2033 年</p>
</div><p>Fab Automation Market By Automated Material Handling Systems, Robotics &amp; Handling Equipment, Equipment Control Software, Advanced Process Control, 200 mm, 300 mm, Integrated Device Manufacturers (IDMs), Foundries, and OSATs - Global Forecast to 2032</p>
<div class="lb-trans"><p>自动化市场：自动化物料搬运系统、机器人及搬运设备、设备控制软件、先进过程控制、200 毫米、300 毫米、集成器件制造商（IDMs）、铸造厂和 OSAT - 全球预测至 2032 年</p>
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根据 MarketsandMarkets™的独家报告，混合键合市场预计到 2032 年将达到 6.339 亿美元