<p><em>将声学和传感技术定位为沉浸式交互的基础</em></p>
<p>, /PRNewswire/ -- 在 2026 年消费电子展（CES）上，Goertek 于 1 月 6 日至 9 日展示了其在声学和传感领域的最新技术解决方案。这些创新旨在帮助消费电子制造商提供更具沉浸感、精准和舒适的互动体验。</p>
<p><strong>智能可穿戴设备的新范式：AI 摄影 OWS 耳塞参考设计</strong></p>
<p>继续阅读</p>
<p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null"/></p>
<p>AI 摄影 OWS 耳塞参考设计</p>
<p>传统可穿戴设备的发展已开始趋于平稳，受到其传统形态和交互模式的限制。像 TWS 耳塞这样的设备，过于依赖语音命令，在嘈杂环境中可用性急剧下降，缺乏多模态 AI 交互或视觉上下文感知。Goertek 的解决方案将声学、视觉和 AI 结合在一起，推出了行业首个 OWS 耳塞参考设计，能够实现高质量的开放音频、多模态 AI 交互、超高清双耳摄影和高清短视频录制。</p>
<p>每个耳塞集成了一颗 1200 万像素的相机，具有三个可调视角。实时直播功能帮助不同耳型的佩戴角度校准。专有的面部去遮挡算法和双耳图像拼接技术使得超高清照片的拍摄具有超过 100 度的水平视场，并支持 1080p 短视频录制。</p>
<p>近场拾音算法精确过滤环境和旁观者噪声，实现 “语音 + 双耳图像” 的 AI 多模态融合交互。专有的浅入耳声学解决方案和双振膜驱动单元解决了 OWS 产品在声音泄漏、低音深度不足和音量不足等关键行业挑战，提供舒适的开放耳体验和一致的高保真音频性能。</p>
<p><strong>核心声学创新：解决薄设计与高保真之间的挑战</strong></p>
<p>向更薄设备和更高保真音频的趋势为核心声学组件带来了重大挑战。在 2026 年 CES 上，Goertek 展示了新的 SPK（微型扬声器）平台、MEMS 声学传感器和音频技术解决方案，旨在解锁产品级差异化。</p>
<p>为了解决流行开放式扬声器面临的音量不足问题，Goertek 推出了一种新的 SPK 解决方案——LBS 扬声器平台，采用双辐射、单面声结构，提供高音量并解决开放式设计中舒适佩戴与清晰音频之间的权衡。该平台还结合了隐私保护技术，采用远场消噪设计，有效减少声音泄漏。</p>
<p>除了 LBS 平台，Goertek 还推出了行业首个超薄大音量 F 平台，专为可折叠手机和平板电脑设计。广受认可的 DR 耳机驱动系列继续提供稳定的性能，专有的 Sandwich 平台现已升级至 2.0 版本，防水性能显著增强。对于智能眼镜，Goertek 推出了针对性的三代 SPK 产品组合，涵盖标准、定制和模块化单元，以适应各种 ID 设计。</p>
<p>在触觉技术方面，Goertek 的 “Dual” 双频双向系统实现了沉浸式 “真实 4D 振动” 体验，具有独特的振动纹理和真实的方向提示再现，满足了紧凑设备中对丰富触觉感受的需求。超紧凑、高性能的 LRA 系列智能手机继续优化性能与尺寸之间的平衡。LRA090835SH 在小尺寸下设定了新的标准，匹配了更大组件的性能，而 LRA159519 则将厚度减少至 1.9mm。</p>
<p>凭借在电磁设计方面的专业知识，超小型的 Twist Air 和 IPD 模块具有高效的驱动系统和平滑的传输结构，实现快速、精确的反馈，支持日益轻量化和空间受限的设计。</p>
<p><strong>MEMS 传感器与音频算法：实现更智能、更灵敏的设备</strong></p>
<p>随着对紧凑、防水和超薄声学组件需求的不断增长，Goertek 的子公司 Goermicro 展示了针对性的 MEMS 声学传感器创新。一种新的紧凑型 IP68 MEMS 声学传感器采用第三代防水架构，在超小的 2.75×1.85mm 占地面积内实现 IP68 保护，满足智能手机和智能手表对轻量、小型化和高可靠性的设计要求。此外，该公司的超薄高性能声学传感器在仅 0.8mm 的高度下提供高达 68dB 的信噪比，消除了尺寸限制。</p>
<p>Goermicro 还展示了一种 VPU（振动/语音拾取）传感器。其工作电流为 120-125μA，能够准确捕捉语音振动信号，同时隔离环境噪声，实现更灵敏和精确的语音交互。凭借通用音频接口兼容性，它为 AI 眼镜的纤薄设计和可靠交互提供了行业领先的传感解决方案。</p>
<p>在音频算法方面，为了解决语音识别性能下降的问题，Goertek 的专有 ASR 前端处理解决方案通过多麦克风阵列集成方向性拾音，并结合基于深度学习的噪声消除算法。它在近场和远场的识别准确率分别达到 98% 和 97%，确保即使在购物中心或地铁等嘈杂环境中也能捕捉到指令，同时支持在低功耗芯片上的实时操作。</p>
<p>展望未来，Goertek 将继续追求声学和传感等核心技术的突破，专注于将系统级创新转化为差异化的产品体验和长期的行业价值。</p>
<p>来源：Goertek</p>
<p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjYwMTA4Jk5ld3NJdGVtSWQ9Q041OTE0OSZUcmFuc21pc3Npb25fSWQ9MjAyNjAxMDgxOTM4UFJfTkVXU19VU1BSX19fX19DTjU5MTQ5?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjYwMTA4Jk5ld3NJdGVtSWQ9Q041OTE0OSZUcmFuc21pc3Npb25fSWQ9MjAyNjAxMDgxOTM4UFJfTkVXU19VU1BSX19fX19DTjU5MTQ5"/></p>

<p>在 2026 年国际消费电子展（CES）上，歌尔展示了声学和传感领域的创新，推出了 AI 摄影 OWS 耳机，该耳机集成了高质量音频、人工智能交互和先进的摄影功能。该公司还展示了新的 SPK 平台和 MEMS 声学传感器，旨在提升更薄设备的音频性能。主要亮点包括用于开放式设计的 LBS 扬声器平台、适用于可折叠设备的超薄声学组件，以及用于改善语音识别的先进音频算法。歌尔旨在引领消费电子领域的沉浸式交互技术</p>

<p><em>Positioning Acoustics and Sensing as Foundations for Immersive Interaction</em></p>
<div class="lb-trans"><p><em>将声学和传感技术定位为沉浸式交互的基础</em></p>
</div><p>, /PRNewswire/ -- At the 2026 Consumer Electronics Show (CES) from January 6–9, Goertek unveiled its latest technology solutions across the full spectrum of acoustics and sensing. These innovations are designed to enable consumer electronics manufacturers to deliver more immersive, precise, and comfortable interactive experiences.</p>
<div class="lb-trans"><p>, /PRNewswire/ -- 在 2026 年消费电子展（CES）上，Goertek 于 1 月 6 日至 9 日展示了其在声学和传感领域的最新技术解决方案。这些创新旨在帮助消费电子制造商提供更具沉浸感、精准和舒适的互动体验。</p>
</div><p><strong>A New Paradigm for Smart Wearables: The AI Photography OWS Earbuds Reference Design</strong></p>
<div class="lb-trans"><p><strong>智能可穿戴设备的新范式：AI 摄影 OWS 耳塞参考设计</strong></p>
</div><p>Continue Reading</p>
<div class="lb-trans"><p>继续阅读</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null" alt="" original-src="https://www.prnewswire.com/news-releases/null"/></p>
<p>AI Photography OWS Earbuds Reference Design</p>
<div class="lb-trans"><p>AI 摄影 OWS 耳塞参考设计</p>
</div><p>The development of traditional wearables has begun to plateau, constrained by their conventional forms and interaction modes. Devices like TWS earbuds, which rely heavily on voice commands, experience a sharp decline in usability in noisy environments and lack multimodal AI interaction or visual contextual awareness. Goertek's solution brings together acoustics, vision, and AI into the industry's first OWS earbuds reference design capable of high-quality open audio, AI multimodal interaction, ultra-high-definition binaural photography, and HD short-video capture.</p>
<div class="lb-trans"><p>传统可穿戴设备的发展已开始趋于平稳，受到其传统形态和交互模式的限制。像 TWS 耳塞这样的设备，过于依赖语音命令，在嘈杂环境中可用性急剧下降，缺乏多模态 AI 交互或视觉上下文感知。Goertek 的解决方案将声学、视觉和 AI 结合在一起，推出了行业首个 OWS 耳塞参考设计，能够实现高质量的开放音频、多模态 AI 交互、超高清双耳摄影和高清短视频录制。</p>
</div><p>Each earpiece integrates a 12-megapixel camera with three adjustable viewing angles. A real-time live-view function assists with wear-angle calibration for different ear shapes. Proprietary algorithms for facial de-occlusion and binaural image stitching enable ultra-HD photo capture with a horizontal field of view exceeding 100 degrees, along with 1080p short video recording.</p>
<div class="lb-trans"><p>每个耳塞集成了一颗 1200 万像素的相机，具有三个可调视角。实时直播功能帮助不同耳型的佩戴角度校准。专有的面部去遮挡算法和双耳图像拼接技术使得超高清照片的拍摄具有超过 100 度的水平视场，并支持 1080p 短视频录制。</p>
</div><p>A near-field pickup algorithm precisely filters ambient and bystander noise, enabling &#34;Voice + Binaural Image&#34; AI multimodal fusion interaction. The proprietary shallow in-ear acoustic solution and dual-diaphragm driver units address key industry challenges for OWS products, such as sound leakage, insufficient bass depth, and lack of loudness, delivering both a comfortable open-ear experience and consistent high-fidelity audio performance.</p>
<div class="lb-trans"><p>近场拾音算法精确过滤环境和旁观者噪声，实现 “语音 + 双耳图像” 的 AI 多模态融合交互。专有的浅入耳声学解决方案和双振膜驱动单元解决了 OWS 产品在声音泄漏、低音深度不足和音量不足等关键行业挑战，提供舒适的开放耳体验和一致的高保真音频性能。</p>
</div><p><strong>Core Acoustics Innovations: Addressing the Thin-Design vs. High-Fidelity Challenge</strong></p>
<div class="lb-trans"><p><strong>核心声学创新：解决薄设计与高保真之间的挑战</strong></p>
</div><p>The trend toward thinner devices with higher-fidelity audio presents significant challenges for core acoustic components. At CES 2026, Goertek showcased new SPK (micro-speaker) platforms, MEMS acoustic sensors, and audio technology solutions that are designed to unlock product-level differentiation.</p>
<div class="lb-trans"><p>向更薄设备和更高保真音频的趋势为核心声学组件带来了重大挑战。在 2026 年 CES 上，Goertek 展示了新的 SPK（微型扬声器）平台、MEMS 声学传感器和音频技术解决方案，旨在解锁产品级差异化。</p>
</div><p>To tackle the insufficient volume facing popular open-style speakers, Goertek introduced a new SPK solution – the LBS speaker platform with a dual-radiation, single-sided sound structure that delivers high loudness and resolves the tradeoff between comfortable wear and clear audio in open-style designs. The platform also incorporates privacy protection technology, using a far-field cancellation design to effectively reduce sound leakage.</p>
<div class="lb-trans"><p>为了解决流行开放式扬声器面临的音量不足问题，Goertek 推出了一种新的 SPK 解决方案——LBS 扬声器平台，采用双辐射、单面声结构，提供高音量并解决开放式设计中舒适佩戴与清晰音频之间的权衡。该平台还结合了隐私保护技术，采用远场消噪设计，有效减少声音泄漏。</p>
</div><p>Alongside the LBS platform, Goertek debuted the industry's first ultra-thin, large-volume F platform for foldable phones and tablets. The widely recognized DR earphone driver series continues to deliver stable performance, and the proprietary Sandwich platform is now upgraded to version 2.0 with significantly enhanced waterproofing. For smart glasses, Goertek launched a targeted portfolio of three SPK generations, covering standard, custom, and modular units to fit various ID designs.</p>
<div class="lb-trans"><p>除了 LBS 平台，Goertek 还推出了行业首个超薄大音量 F 平台，专为可折叠手机和平板电脑设计。广受认可的 DR 耳机驱动系列继续提供稳定的性能，专有的 Sandwich 平台现已升级至 2.0 版本，防水性能显著增强。对于智能眼镜，Goertek 推出了针对性的三代 SPK 产品组合，涵盖标准、定制和模块化单元，以适应各种 ID 设计。</p>
</div><p>In haptics, Goertek's &#34;Dual&#34; Dual-Frequency Bi-Directional System enables an immersive &#34;true 4D vibration&#34; experience with distinct vibration textures and realistic reproduction of directional cues, addressing the demand for rich tactile sensations in compact devices. The ultra-compact, high-performance LRA series for smartphones continues to optimize the balance between performance and size. The LRA090835SH sets a new standard by matching larger-component performance in a small size, while the LRA159519 reduces thickness to 1.9mm.</p>
<div class="lb-trans"><p>在触觉技术方面，Goertek 的 “Dual” 双频双向系统实现了沉浸式 “真实 4D 振动” 体验，具有独特的振动纹理和真实的方向提示再现，满足了紧凑设备中对丰富触觉感受的需求。超紧凑、高性能的 LRA 系列智能手机继续优化性能与尺寸之间的平衡。LRA090835SH 在小尺寸下设定了新的标准，匹配了更大组件的性能，而 LRA159519 则将厚度减少至 1.9mm。</p>
</div><p>Drawing on expertise in electromagnetic design, the ultra-small Twist Air and IPD modules feature efficient drive systems and smooth transmission structures for fast, precise feedback, supporting increasingly lightweight and space-constrained designs.</p>
<div class="lb-trans"><p>凭借在电磁设计方面的专业知识，超小型的 Twist Air 和 IPD 模块具有高效的驱动系统和平滑的传输结构，实现快速、精确的反馈，支持日益轻量化和空间受限的设计。</p>
</div><p><strong>MEMS Sensors &amp; Audio Algorithms: Enabling Smarter, More Responsive Devices</strong></p>
<div class="lb-trans"><p><strong>MEMS 传感器与音频算法：实现更智能、更灵敏的设备</strong></p>
</div><p>As the need for compact, waterproof, and ultra-thin acoustic components continues to grow, Goertek's subsidiary Goermicro displayed targeted MEMS acoustic sensor innovations. A new compact IP68 MEMS acoustic sensor uses a third-generation waterproof architecture to achieve IP68 protection in an ultra-small 2.75×1.85mm footprint, meeting the design requirements of smartphones and smartwatches for lightweight, small form factors and high reliability. In addition, the firm's ultra-thin, high-performance acoustic sensor eliminates size constraints by delivering a high 68dB signal-to-noise ratio at a height of just 0.8mm.</p>
<div class="lb-trans"><p>随着对紧凑、防水和超薄声学组件需求的不断增长，Goertek 的子公司 Goermicro 展示了针对性的 MEMS 声学传感器创新。一种新的紧凑型 IP68 MEMS 声学传感器采用第三代防水架构，在超小的 2.75×1.85mm 占地面积内实现 IP68 保护，满足智能手机和智能手表对轻量、小型化和高可靠性的设计要求。此外，该公司的超薄高性能声学传感器在仅 0.8mm 的高度下提供高达 68dB 的信噪比，消除了尺寸限制。</p>
</div><p>Goermicro also presented a VPU (Vibration/Voice Pick-up) Sensor. Operating at a low power of 120-125μA, it accurately captures voice vibration signals while isolating environmental noise for more responsive and precise voice interaction. With universal audio interface compatibility, it offers an industry-leading sensing solution for the slim design and reliable interaction of AI glasses.</p>
<div class="lb-trans"><p>Goermicro 还展示了一种 VPU（振动/语音拾取）传感器。其工作电流为 120-125μA，能够准确捕捉语音振动信号，同时隔离环境噪声，实现更灵敏和精确的语音交互。凭借通用音频接口兼容性，它为 AI 眼镜的纤薄设计和可靠交互提供了行业领先的传感解决方案。</p>
</div><p>In audio algorithms, to address reduced voice recognition performance, Goertek's proprietary ASR Front-End Processing Solution integrates directional pickup via multi-microphone arrays in tandem with deep learning-based noise cancellation algorithms. It achieves exceptional recognition accuracy of 98% near-field and 97% far-field, ensuring commands are captured even in noisy settings like malls or subways, while supporting real-time operation on low-power chips.</p>
<div class="lb-trans"><p>在音频算法方面，为了解决语音识别性能下降的问题，Goertek 的专有 ASR 前端处理解决方案通过多麦克风阵列集成方向性拾音，并结合基于深度学习的噪声消除算法。它在近场和远场的识别准确率分别达到 98% 和 97%，确保即使在购物中心或地铁等嘈杂环境中也能捕捉到指令，同时支持在低功耗芯片上的实时操作。</p>
</div><p>Looking ahead, Goertek will continue to pursue breakthroughs in core technologies like acoustics and sensing, with a focus on translating system-level innovation into differentiated product experiences and long-term industry value.</p>
<div class="lb-trans"><p>展望未来，Goertek 将继续追求声学和传感等核心技术的突破，专注于将系统级创新转化为差异化的产品体验和长期的行业价值。</p>
</div><p>SOURCE Goertek</p>
<div class="lb-trans"><p>来源：Goertek</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjYwMTA4Jk5ld3NJdGVtSWQ9Q041OTE0OSZUcmFuc21pc3Npb25fSWQ9MjAyNjAxMDgxOTM4UFJfTkVXU19VU1BSX19fX19DTjU5MTQ5" alt="" original-src="https://rt.prnewswire.com/rt.gif?NewsItemId=CN59149&amp;Transmission_Id=202601081938PR_NEWS_USPR_____CN59149&amp;DateId=20260108"/></p>

歌尔声学在 2026 年 CES 上展示全栈声学和传感技术创新