<h2>订单满满：这家先进封装制造商的订单延续多年，因为人工智能热潮对材料的需求超过了行业产能</h2>
<p>辛耘科技（Scientech Corp）专注于提供先进封装设备和再生晶圆，预计到 2028 年将有清晰的订单可见性，受益于对用于生产人工智能（AI）芯片的芯片制造设备的爆炸性需求。</p>
<p>该公司表示，再生晶圆主要用于监测、测试和校准半导体设备，而不是用于实际芯片的生产，辛耘科技分销用于光刻、蚀刻、薄膜工艺的其他品牌的半导体制造设备。</p>
<p>辛耘科技周三表示，已预订高达 130 亿新台币（约合 4.15 亿美元）的合同负债，表明客户需求旺盛，未来几年有潜在的收入增长，因其已收到预付款。</p>
<p>该公司的增长动力来自于对用于生产 AI 芯片和高性能计算（HPC）设备的先进芯片封装设备的强劲需求。</p>
<p>这导致设备交付周期缩短至约 8 到 12 个月，而类似设备的平均交付周期为 4 到 6 个月。</p>
<p>“我们自有品牌的产能今年已被完全预订。我们正在为明年和后年做准备，” 辛耘科技副董事长许明棋在台北的媒体聚会上告诉记者。“客户对用于 AI 和 HPC 相关应用的先进封装设备的需求非常强劲。我们无法跟上他们的步伐。”</p>
<p>该公司表示，半导体行业的增长速度 “令人震惊”，这是前所未见的。全球半导体行业预计今年将产生 1 万亿美元的收入，早于大多数行业研究机构估计的 2030 或 2031 年。</p>
<p>为了满足客户需求，辛耘科技正在新建工厂，以扩大位于新竹县湖口乡和台南的先进封装设备和再生晶圆的产能。到 2028 年，该公司将使自有品牌设备的产能翻倍。</p>
<p>强劲的增长势头预计将使其自有品牌设备和再生晶圆的收入占比在今年超过 50%，而过去几年为 40%。</p>
<p>该公司计划在明年上半年在美国设立新的销售和服务办公室，以满足客户需求，并与主要客户在亚利桑那州的新先进封装厂建设保持一致。</p>
<p>辛耘科技去年的收入同比增长 17.37%，达到 113.7 亿新台币，首次超过 100 亿新台币，创下历史新高。</p>

标普半导体 ETF - SPDR

动态半导体 ETF - Invesco

费城交易所 半导体 ETF - iShares

半导体 ETF - VanEck Vectors

STAI

<p>Scientech Corp 已获得订单，延续至 2028 年，受益于对人工智能芯片制造设备的强劲需求。该公司报告的合同负债为 130 亿新台币，显示出客户的强烈兴趣和潜在的收入增长。由于交货周期目前为 8-12 个月，Scientech 正在扩大其在新竹和台南的生产能力。半导体行业预计今年将达到 1 万亿美元，这促使 Scientech 增强其设备产能，并在美国建立新的销售办公室以支持客户需求</p>

<h2>BOOKED SOLID: The advanced packaging manufacturer has orders stretching out for years as the AI boom’s ravenous demand for material outstrips industry capacity</h2>
<div class="lb-trans"><h2>订单满满：这家先进封装制造商的订单延续多年，因为人工智能热潮对材料的需求超过了行业产能</h2>
</div><p>Scientech Corp (辛耘), which specializes in supplying advanced packaging equipment and reclaimed wafers, has clear order visibility through 2028, benefiting from explosive demand for chip manufacturing equipment used to produce artificial intelligence (AI) chips.</p>
<div class="lb-trans"><p>辛耘科技（Scientech Corp）专注于提供先进封装设备和再生晶圆，预计到 2028 年将有清晰的订单可见性，受益于对用于生产人工智能（AI）芯片的芯片制造设备的爆炸性需求。</p>
</div><p>Reclaimed wafers are primarily used for monitoring, testing and calibrating semiconductor equipment rather than producing actual chips, said the company, which distributes semiconductor manufacturing equipment used in lithography, etching, thin-film processes from other brands.</p>
<div class="lb-trans"><p>该公司表示，再生晶圆主要用于监测、测试和校准半导体设备，而不是用于实际芯片的生产，辛耘科技分销用于光刻、蚀刻、薄膜工艺的其他品牌的半导体制造设备。</p>
</div><p>Scientech on Wednesday said it booked as much as NT$13 billion (US$415 million) in contract liabilities, indicating brisk customer demand and potential revenue growth for the next few years after receiving advanced payments.</p>
<div class="lb-trans"><p>辛耘科技周三表示，已预订高达 130 亿新台币（约合 4.15 亿美元）的合同负债，表明客户需求旺盛，未来几年有潜在的收入增长，因其已收到预付款。</p>
</div><p>The growth momentum is fueled by strong demand for advanced chip packaging equipment used in the production of AI chips and high-performance computing (HPC) devices, the company said.</p>
<div class="lb-trans"><p>该公司的增长动力来自于对用于生产 AI 芯片和高性能计算（HPC）设备的先进芯片封装设备的强劲需求。</p>
</div><p>That has led to telescoping equipment delivery lead time to about eight to 12 months, it said. That is longer than an average delivery period of between four and six months for similar equipment.</p>
<div class="lb-trans"><p>这导致设备交付周期缩短至约 8 到 12 个月，而类似设备的平均交付周期为 4 到 6 个月。</p>
</div><p>“Our own-brand capacity has been fully booked this year. We are preparing for next year and the year after,” Scientech vice chairman M.T. Hsu (許明棋) told reporters at a media gathering in Taipei. “Customers’ demand for advanced packaging equipment used in AI and HPC-related applications is very strong. We cannot catch up with their pace.”</p>
<div class="lb-trans"><p>“我们自有品牌的产能今年已被完全预订。我们正在为明年和后年做准备，” 辛耘科技副董事长许明棋在台北的媒体聚会上告诉记者。“客户对用于 AI 和 HPC 相关应用的先进封装设备的需求非常强劲。我们无法跟上他们的步伐。”</p>
</div><p>The semiconductor industry is growing at such an “overwhelming” pace, which has not previously been seen, the company said. The global semiconductor industry is likely to generate US$1 trillion this year, earlier than the 2030 or 2031 mark estimated by most industry research houses, it said.</p>
<div class="lb-trans"><p>该公司表示，半导体行业的增长速度 “令人震惊”，这是前所未见的。全球半导体行业预计今年将产生 1 万亿美元的收入，早于大多数行业研究机构估计的 2030 或 2031 年。</p>
</div><p>To meet customer demand, Scientech is building new factories to expand advanced packaging equipment and reclaimed wafers capacity in Hsinchu County’s Hukou Township (湖口) and in Tainan. By 2028, the company would double its own-brand equipment capacity, it said.</p>
<div class="lb-trans"><p>为了满足客户需求，辛耘科技正在新建工厂，以扩大位于新竹县湖口乡和台南的先进封装设备和再生晶圆的产能。到 2028 年，该公司将使自有品牌设备的产能翻倍。</p>
</div><p>The strong growth momentum is expected to boost its own-brand equipment and reclaimed wafer revenue share to more than 50 percent of its total revenue this year, compared with 40 percent in the past few years, Scientech said.</p>
<div class="lb-trans"><p>强劲的增长势头预计将使其自有品牌设备和再生晶圆的收入占比在今年超过 50%，而过去几年为 40%。</p>
</div><p>The company plans to create a new sales and services office in the US by the first half of next year to meet customer demand and align with a major customer’s new advanced packaging fab construction in Arizona, it said.</p>
<div class="lb-trans"><p>该公司计划在明年上半年在美国设立新的销售和服务办公室，以满足客户需求，并与主要客户在亚利桑那州的新先进封装厂建设保持一致。</p>
</div><p>Scientech’s revenue last year grew 17.37 percent year-on-year to NT$11.37 billion, surpassing NT$10 billion for the first time and setting an all-time high.</p>
<div class="lb-trans"><p>辛耘科技去年的收入同比增长 17.37%，达到 113.7 亿新台币，首次超过 100 亿新台币，创下历史新高。</p>
</div>

Scientech 的订单已排到 2028 年