<p><em>收购增加了包括激光器和增益芯片在内的磷化铟光电设备</em></p>
<p>加利福尼亚州卡马里奥 --（商业资讯）--Semtech Corporation（纳斯达克：SMTC），一家领先的高性能半导体、物联网（IoT）系统和云连接服务解决方案提供商，今天宣布收购 HieFo Corporation（HieFo），这是一家位于加利福尼亚的私人制造商，专注于高效磷化铟（InP）光电设备，用于数据中心互连（DCI）和数据中心内部互连的光收发器。</p>
<p>将 HieFo 纳入 Semtech 的半导体解决方案组合，增强了美国技术供应链，在人工智能基础设施建设的关键转折点上增加了新的产能和韧性。该交易还代表了一个引入光模块供应链关键上游组件的绝佳机会，直接融入 Semtech 不断增长的数据中心平台，为其广泛的芯片组组合增加了另一个重要元素，以支持数据中心网络连接。</p>
<p>“向 1.6T 和 3.2T 数据中心架构的演变代表了光互连复杂性的根本变化，” Semtech 的总裁兼首席执行官 Hong Hou 表示。“通过将 HieFo 成熟的 InP 技术，包括激光器和增益芯片，与 Semtech 行业领先的 TIA 和激光驱动器相结合，我们可以为客户提供下一代光平台的全面解决方案，包括共封装光学（CPO）或近封装光学（NPO），进一步巩固 Semtech 在高带宽、低功耗和低延迟网络解决方案中的领导地位。同样重要的是，我们坚信通过此次收购带入 Semtech 的人才和国内能力，并致力于投资他们的成长和成功。”</p>
<p><strong>HieFo 解决方案</strong></p>
<p>HieFo 继续开发创新和高效能的光电组件解决方案，以服务于人工智能连接市场，利用超过四十年的光电设备创新经验。HieFo 的核心技术集中在基于 InP 的增益芯片和分布反馈（DFB）激光芯片上。增益芯片是嵌入可调激光器中的发光构件，为用于数据中心应用的相干光收发器提供动力。此外，HieFo 的 DFB 激光平台在温度变化下为强度调制直接检测（IMDD）链路提供最佳的功率和墙插效率，这些链路用于光收发器模块。</p>
<p>通过收购 HieFo，Semtech 获得了与其行业领先的跨阻放大器（TIA）和激光/调制驱动器共同开发和优化 InP 光电芯片性能的能力，创建一个优化的电子 - 光电 - 光子芯片组，以支持高带宽收发器。这种集成水平使得激光 - 调制器 - 驱动器接口的性能优化更加紧密，降低了系统功耗，并为超大规模数据中心提供差异化产品，以应对 1.6T 和下一代 3.2T 光模块的严格要求。</p>
<p><strong>财务细节</strong></p>
<p>Semtech 以约 3400 万美元现金收购 HieFo Corporation。为了满足来自众多超大规模数据中心和其他人工智能生态系统客户日益增长的需求，Semtech 已在 HieFo 位于加利福尼亚州阿罕布拉的工厂启动了一项投资和招聘计划，以扩大国内制造能力并加速产品开发。HieFo 的整合工作正在进行中，预计该交易将在第一年内对非 GAAP 稀释每股收益产生积极影响。</p>
<p><strong>监管批准</strong></p>
<p>该交易已由美国外国投资委员会审查，并获得非反对意见，符合 2026 年 1 月 2 日的总统命令，涉及 HieFo。</p>
<p><strong>Semtech 在 OFC 2026</strong></p>
<p>客户和合作伙伴被邀请于 2026 年 3 月 17 日至 19 日在加利福尼亚州洛杉矶的 OFC 2026 展会中访问 Semtech 的展位#1812，与 Semtech 的技术专家会面。安排会议或了解更多信息，请访问 www.semtech.com。</p>
<p><strong>前瞻性声明</strong></p>
<p>本新闻稿包含根据 1995 年《私人证券诉讼改革法案》修订版的 “安全港” 条款的 “前瞻性声明”，基于公司对待收购及其运营、行业、财务状况、业绩、运营结果和流动性的当前预期、估计和预测。前瞻性声明是指除历史信息或当前状况声明以外的声明，涉及与 HieFo Corporation 的收购相关的期望，包括收购的预期收益、投资和整合计划以及与该交易相关的增值预期。包含 “可能”、“相信”、“看到”、“预期”、“期望”、“意图”、“定位”、“计划”、“项目”、“目标”、“估计”、“开发”、“应该”、“可以”、“将”、“旨在”、“预测” 或 “展望” 等词语或其他类似表达的声明构成前瞻性声明。</p>
<p>前瞻性声明涉及已知和未知的风险和不确定性，这可能导致实际结果和事件与预测的结果存在重大差异。可能导致实际结果与前瞻性声明中的结果存在重大差异的潜在因素包括但不限于：与 HieFo 运营整合相关的成本和不确定性，包括公司留住员工的能力、公司成功将 HieFo 的产品线与其产品整合的能力的不确定性，以及收购的预期收益可能无法完全实现或实现所需时间超过预期的风险。影响公司及其运营的其他风险和不确定性也可能导致实际结果与前瞻性声明中的结果存在重大差异，包括：我们财务结果的波动性或我们行业周期性特征的影响，包括在行业低迷期间或由于周期性经济不确定性；某些产品平均售价的历史快速下降；美国或外国政府运营、资金或激励措施的中断；影响公司贸易和投资的出口限制和法律的变化，包括关税或报复性关税；我们依赖的有限数量的供应商和分包商的供应或服务中断或损失；我们供应商的生产能力限制或其他供应链中断；未能成功开发和销售新产品、满足新的行业标准或要求或预见到预期或最终市场用户的变化；未能充分保护我们的知识产权；未能进行保持竞争力所需的重大研发投资或未能正确预见市场竞争变化；我们的产品被发现有缺陷的可能性或对我们提出的责任索赔的风险；业务中断，例如自然灾害、暴力行为和传染病的爆发；中国一般经济条件的不利变化；失去我们少数客户中的任何一个或未能从他们那里收回应收款；来自新兴或成熟的物联网、云服务和无线服务公司的竞争，或来自资源更丰富的公司的竞争；以及公司向证券交易委员会（“SEC”）提交的文件中披露的其他风险和不确定性，包括公司截至 2025 年 1 月 26 日的财政年度的 10-K 表格年报，该年报于 2025 年 3 月 25 日向 SEC 提交，因这些风险因素可能会不时被公司后续向 SEC 提交的报告修订、补充或取代。鉴于此处包含的前瞻性信息固有的重大风险和不确定性，可能导致实际表现和结果与预测存在重大差异，因此任何此类前瞻性信息不应被视为公司对未来表现或结果的陈述或保证，或其目标或计划将实现，或其任何运营预期或财务预测将实现。报告的结果不应被视为未来表现的指示。投资者被提醒不要对此处包含的任何前瞻性信息过度依赖，这些信息仅反映管理层截至本日期的分析。这些前瞻性声明仅在本日期有效。除法律要求外，公司不承担公开发布任何前瞻性声明的更新或修订结果的义务，这些更新或修订可能反映本日期之后的新信息、事件或情况，或反映意外或未来事件的发生，或其他情况。</p>
<p><strong>关于 Semtech 公司</strong></p>
<p>Semtech 公司（纳斯达克代码：SMTC）是一家高性能半导体、物联网系统和云连接服务提供商，致力于提供高质量的技术解决方案，以实现更智能、更互联和可持续的地球。我们的全球团队致力于赋能解决方案架构师和应用开发人员，为基础设施、工业和消费市场开发突破性产品。要了解更多关于 Semtech 技术的信息，请访问 Semtech.com 或在 LinkedIn 或 X 上关注我们。</p>
<p>SMTC-F</p>
<p><img src="https://imageproxy.pbkrs.com/https://cts.businesswire.com/ct/CT/query-ZGlzdHJvPW54JmlkPWJ3bmV3cyZsYW5nPWVuJnNpZD1hY3FyOCZzdHk9MjAyNjAzMDM0NDQxMzhyMQ?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://cts.businesswire.com/ct/CT/query-ZGlzdHJvPW54JmlkPWJ3bmV3cyZsYW5nPWVuJnNpZD1hY3FyOCZzdHk9MjAyNjAzMDM0NDQxMzhyMQ"/></p>
<p>在 businesswire.com 查看源版本：https://www.businesswire.com/news/home/20260303444138/en/</p>
<p>投资者：Mitch Haws，webir@semtech.com</p>
<p>媒体：Michelle Lozada，pr@semtech.com</p>
<p>来源：Semtech 公司</p>

半导体 ETF - VanEck Vectors

标普半导体 ETF - SPDR

费城交易所 半导体 ETF - iShares

动态半导体 ETF - Invesco

先科电子

纳斯达克半导体 ETF - First Trust

半导体 3 倍做多 - Direxion

<p>Semtech 公司以约 3400 万美元收购了 HieFo 公司，增强了其数据中心产品组合，增加了高效的磷化铟光电设备。此次收购旨在加强美国的技术供应链，并支持对人工智能基础设施日益增长的需求。Semtech 计划投资于 HieFo 的生产能力和产品开发，预计整合将在第一年内对收益产生积极影响。该交易已获得监管批准，并与 Semtech 提供下一代光学平台综合解决方案的战略相一致</p>

<p><em>Acquisition Adds Indium Phosphide Optoelectronic Devices Including Lasers and Gain Chips</em></p>
<div class="lb-trans"><p><em>收购增加了包括激光器和增益芯片在内的磷化铟光电设备</em></p>
</div><p>CAMARILLO, Calif.--(BUSINESS WIRE)--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.</p>
<div class="lb-trans"><p>加利福尼亚州卡马里奥 --（商业资讯）--Semtech Corporation（纳斯达克：SMTC），一家领先的高性能半导体、物联网（IoT）系统和云连接服务解决方案提供商，今天宣布收购 HieFo Corporation（HieFo），这是一家位于加利福尼亚的私人制造商，专注于高效磷化铟（InP）光电设备，用于数据中心互连（DCI）和数据中心内部互连的光收发器。</p>
</div><p>The addition of HieFo to Semtech’s portfolio of semiconductor solutions bolsters U.S. technology supply chains, adding new capacity and resiliency at a key inflection point in the AI infrastructure buildout. The transaction also represents a compelling opportunity to infuse critical upstream components for the optical module supply chain directly into Semtech's growing data center platform, adding another vital element to its expansive chipset portfolio for data center networking connectivity.</p>
<div class="lb-trans"><p>将 HieFo 纳入 Semtech 的半导体解决方案组合，增强了美国技术供应链，在人工智能基础设施建设的关键转折点上增加了新的产能和韧性。该交易还代表了一个引入光模块供应链关键上游组件的绝佳机会，直接融入 Semtech 不断增长的数据中心平台，为其广泛的芯片组组合增加了另一个重要元素，以支持数据中心网络连接。</p>
</div><p>“The evolution to 1.6T and 3.2T data center architectures represents a fundamental shift in optical interconnect complexity,” said Hong Hou, president and CEO of Semtech. “By combining HieFo’s proven InP technology, including lasers and gain chips, with Semtech’s industry-leading TIAs and laser drivers, we can offer customers a comprehensive solution for next-generation optical platforms, including co-packaged optics (CPO) or near-packaged optics (NPO), strengthening Semtech’s position as a leader in high-bandwidth, low-power and low-latency networking solutions. Equally important, we believe strongly in the people and domestic capabilities we are bringing into Semtech through this acquisition, and we are committed to investing in their growth and success.”</p>
<div class="lb-trans"><p>“向 1.6T 和 3.2T 数据中心架构的演变代表了光互连复杂性的根本变化，” Semtech 的总裁兼首席执行官 Hong Hou 表示。“通过将 HieFo 成熟的 InP 技术，包括激光器和增益芯片，与 Semtech 行业领先的 TIA 和激光驱动器相结合，我们可以为客户提供下一代光平台的全面解决方案，包括共封装光学（CPO）或近封装光学（NPO），进一步巩固 Semtech 在高带宽、低功耗和低延迟网络解决方案中的领导地位。同样重要的是，我们坚信通过此次收购带入 Semtech 的人才和国内能力，并致力于投资他们的成长和成功。”</p>
</div><p><strong>HieFo Solutions</strong></p>
<div class="lb-trans"><p><strong>HieFo 解决方案</strong></p>
</div><p>HieFo continues to develop innovative and power efficient optoelectronic component solutions to serve AI connectivity markets, leveraging more than four decades of innovation in optoelectronic devices. HieFo’s core technology centers on InP-based gain chips and distributed feedback (DFB) laser chips. Gain chips are the light-emitting building blocks embedded within tunable lasers that power coherent optical transceivers used across data center applications. In addition, HieFo’s DFB laser platform offers best-in-class power and wall plug efficiency over temperature for intensity-modulation direct-detection (IMDD) links used in optical transceiver modules.</p>
<div class="lb-trans"><p>HieFo 继续开发创新和高效能的光电组件解决方案，以服务于人工智能连接市场，利用超过四十年的光电设备创新经验。HieFo 的核心技术集中在基于 InP 的增益芯片和分布反馈（DFB）激光芯片上。增益芯片是嵌入可调激光器中的发光构件，为用于数据中心应用的相干光收发器提供动力。此外，HieFo 的 DFB 激光平台在温度变化下为强度调制直接检测（IMDD）链路提供最佳的功率和墙插效率，这些链路用于光收发器模块。</p>
</div><p>By acquiring HieFo, Semtech gains the ability to co-develop and co-optimize InP optoelectronic chip performance alongside its industry-leading transimpedance amplifiers (TIAs) and laser/modulator drivers, creating an optimized electronic-optoelectronic-photonic chipset for high bandwidth transceivers. This level of integration enables tighter performance optimization across the laser-modulator-driver interface, reduces system power consumption, and offers differentiated products for hyperscalers, navigating the demanding requirements of 1.6T and next-generation 3.2T optical modules.</p>
<div class="lb-trans"><p>通过收购 HieFo，Semtech 获得了与其行业领先的跨阻放大器（TIA）和激光/调制驱动器共同开发和优化 InP 光电芯片性能的能力，创建一个优化的电子 - 光电 - 光子芯片组，以支持高带宽收发器。这种集成水平使得激光 - 调制器 - 驱动器接口的性能优化更加紧密，降低了系统功耗，并为超大规模数据中心提供差异化产品，以应对 1.6T 和下一代 3.2T 光模块的严格要求。</p>
</div><p><strong>Financial Details</strong></p>
<div class="lb-trans"><p><strong>财务细节</strong></p>
</div><p>Semtech acquired HieFo Corporation for approximately $34 million in cash. To meet significantly growing demand from numerous hyperscalers and other customers across the AI ecosystem, Semtech has initiated an investment and hiring plan at HieFo’s Alhambra, California site to expand domestic manufacturing capacity and accelerate product development. Integration of HieFo into Semtech’s operations is underway, with the transaction expected to be accretive to non-GAAP diluted earnings per share within the first year.</p>
<div class="lb-trans"><p>Semtech 以约 3400 万美元现金收购 HieFo Corporation。为了满足来自众多超大规模数据中心和其他人工智能生态系统客户日益增长的需求，Semtech 已在 HieFo 位于加利福尼亚州阿罕布拉的工厂启动了一项投资和招聘计划，以扩大国内制造能力并加速产品开发。HieFo 的整合工作正在进行中，预计该交易将在第一年内对非 GAAP 稀释每股收益产生积极影响。</p>
</div><p><strong>Regulatory Approval</strong></p>
<div class="lb-trans"><p><strong>监管批准</strong></p>
</div><p>The transaction was reviewed by and received the non-objection of the Committee on Foreign Investment in the United States, in compliance with the Presidential order of Jan. 2, 2026, regarding HieFo.</p>
<div class="lb-trans"><p>该交易已由美国外国投资委员会审查，并获得非反对意见，符合 2026 年 1 月 2 日的总统命令，涉及 HieFo。</p>
</div><p><strong>Semtech at OFC 2026</strong></p>
<div class="lb-trans"><p><strong>Semtech 在 OFC 2026</strong></p>
</div><p>Customers and partners are invited to visit Semtech at booth #1812 during OFC 2026, Mar. 17–19, 2026 in Los Angeles, California, to meet with Semtech’s technical experts. Schedule a meeting or learn more at www.semtech.com.</p>
<div class="lb-trans"><p>客户和合作伙伴被邀请于 2026 年 3 月 17 日至 19 日在加利福尼亚州洛杉矶的 OFC 2026 展会中访问 Semtech 的展位#1812，与 Semtech 的技术专家会面。安排会议或了解更多信息，请访问 www.semtech.com。</p>
</div><p><strong>Forward-Looking Statements</strong></p>
<div class="lb-trans"><p><strong>前瞻性声明</strong></p>
</div><p>This press release contains “forward-looking statements” within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995, as amended, based on the Company's current expectations, estimates and projections about the pending acquisition as well as its operations, industry, financial condition, performance, results of operations, and liquidity. Forward-looking statements are statements other than historical information or statements of current condition and relate to matters such as expectations related to the acquisition of HieFo Corporation, including the anticipated benefits of the acquisition, investment and integration plans and accretion expectations with respect to the transaction. Statements containing words such as “may,” “believes,” “see,” “anticipates,” “expects,” “intends,” “positions,” “plans,” “projects,” “objectives,” “estimates,” “develops,” “should,” “could,” “will,” “designed to,” “projections,” or “outlook,” or other similar expressions constitute forward-looking statements.</p>
<div class="lb-trans"><p>本新闻稿包含根据 1995 年《私人证券诉讼改革法案》修订版的 “安全港” 条款的 “前瞻性声明”，基于公司对待收购及其运营、行业、财务状况、业绩、运营结果和流动性的当前预期、估计和预测。前瞻性声明是指除历史信息或当前状况声明以外的声明，涉及与 HieFo Corporation 的收购相关的期望，包括收购的预期收益、投资和整合计划以及与该交易相关的增值预期。包含 “可能”、“相信”、“看到”、“预期”、“期望”、“意图”、“定位”、“计划”、“项目”、“目标”、“估计”、“开发”、“应该”、“可以”、“将”、“旨在”、“预测” 或 “展望” 等词语或其他类似表达的声明构成前瞻性声明。</p>
</div><p>Forward-looking statements involve known and unknown risks and uncertainties that could cause actual results and events to differ materially from those projected. Potential factors that could cause actual results to differ materially from those in the forward-looking statements include, but are not limited to: costs and uncertainties associated with the integration of HieFo’s operations, including the Company’s ability to retain employees, uncertainties about the Company’s ability to successfully integrate HieFo’s product lines with its products, and the risk that the anticipated benefits of the acquisition may not be fully realized or may take longer to realize than expected. Additional risks and uncertainties affecting the Company and its operations that could also cause actual results to differ materially from those in the forward-looking statements include: the volatility of our financial results or impact of the cyclical nature of our industry, including during industry downturns or due to periodic economic uncertainty; the historical rapid decrease of the average selling prices of certain products; disruptions in U.S. or foreign government operations, funding or incentives; changes in export restrictions and laws affecting the Company's trade and investments, including tariffs or retaliatory tariffs; interruption or loss of supplies or services from the limited number of suppliers and subcontractors we rely upon; our suppliers' manufacturing capacity constraints or other supply chain disruptions; failure to successfully develop and sell new products, meet new industry standards or requirements or anticipate changes in projected or end market users; failure to adequately protect our intellectual property rights; failure to make the substantial investments in research and development that are required to remain competitive in our business or to properly anticipate competitive changes in the marketplace; the likelihood of our products being found defective or risk of liability claims asserted against us; business interruptions, such as natural disasters, acts of violence and the outbreak of contagious diseases; adverse changes to general economic conditions in China; the loss of any one of our small number of customers or failure to collect a receivable from them; competition from new or established IoT, cloud services and wireless service companies or from those with greater resources;and the other risks and uncertainties contained in the risk factors disclosed in the Company's filings with the Securities and Exchange Commission (the “SEC”), including the Company's Annual Report on Form 10-K for the fiscal year ended January 26, 2025, filed with the SEC on March 25, 2025 as such risk factors may be amended, supplemented or superseded from time to time by subsequent reports the Company files with the SEC. In light of the significant risks and uncertainties inherent in the forward-looking information included herein that may cause actual performance and results to differ materially from those predicted, any such forward-looking information should not be regarded as representations or guarantees by the Company of future performance or results, or that its objectives or plans will be achieved or that any of its operating expectations or financial forecasts will be realized. Reported results should not be considered an indication of future performance. Investors are cautioned not to place undue reliance on any forward-looking information contained herein, which reflect management's analysis only as of the date hereof. These forward-looking statements speak only as of the date hereof. Except as required by law, the Company assumes no obligation to publicly release the results of any update or revision to any forward-looking statement that may be made to reflect new information, events or circumstances after the date hereof or to reflect the occurrence of unanticipated or future events, or otherwise.</p>
<div class="lb-trans"><p>前瞻性声明涉及已知和未知的风险和不确定性，这可能导致实际结果和事件与预测的结果存在重大差异。可能导致实际结果与前瞻性声明中的结果存在重大差异的潜在因素包括但不限于：与 HieFo 运营整合相关的成本和不确定性，包括公司留住员工的能力、公司成功将 HieFo 的产品线与其产品整合的能力的不确定性，以及收购的预期收益可能无法完全实现或实现所需时间超过预期的风险。影响公司及其运营的其他风险和不确定性也可能导致实际结果与前瞻性声明中的结果存在重大差异，包括：我们财务结果的波动性或我们行业周期性特征的影响，包括在行业低迷期间或由于周期性经济不确定性；某些产品平均售价的历史快速下降；美国或外国政府运营、资金或激励措施的中断；影响公司贸易和投资的出口限制和法律的变化，包括关税或报复性关税；我们依赖的有限数量的供应商和分包商的供应或服务中断或损失；我们供应商的生产能力限制或其他供应链中断；未能成功开发和销售新产品、满足新的行业标准或要求或预见到预期或最终市场用户的变化；未能充分保护我们的知识产权；未能进行保持竞争力所需的重大研发投资或未能正确预见市场竞争变化；我们的产品被发现有缺陷的可能性或对我们提出的责任索赔的风险；业务中断，例如自然灾害、暴力行为和传染病的爆发；中国一般经济条件的不利变化；失去我们少数客户中的任何一个或未能从他们那里收回应收款；来自新兴或成熟的物联网、云服务和无线服务公司的竞争，或来自资源更丰富的公司的竞争；以及公司向证券交易委员会（“SEC”）提交的文件中披露的其他风险和不确定性，包括公司截至 2025 年 1 月 26 日的财政年度的 10-K 表格年报，该年报于 2025 年 3 月 25 日向 SEC 提交，因这些风险因素可能会不时被公司后续向 SEC 提交的报告修订、补充或取代。鉴于此处包含的前瞻性信息固有的重大风险和不确定性，可能导致实际表现和结果与预测存在重大差异，因此任何此类前瞻性信息不应被视为公司对未来表现或结果的陈述或保证，或其目标或计划将实现，或其任何运营预期或财务预测将实现。报告的结果不应被视为未来表现的指示。投资者被提醒不要对此处包含的任何前瞻性信息过度依赖，这些信息仅反映管理层截至本日期的分析。这些前瞻性声明仅在本日期有效。除法律要求外，公司不承担公开发布任何前瞻性声明的更新或修订结果的义务，这些更新或修订可能反映本日期之后的新信息、事件或情况，或反映意外或未来事件的发生，或其他情况。</p>
</div><p><strong>About Semtech Corporation</strong></p>
<div class="lb-trans"><p><strong>关于 Semtech 公司</strong></p>
</div><p>Semtech Corporation (Nasdaq: SMTC) is a high-performance semiconductor, IoT systems, and cloud connectivity service provider dedicated to delivering high-quality technology solutions that enable a smarter, more connected, and sustainable planet. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.</p>
<div class="lb-trans"><p>Semtech 公司（纳斯达克代码：SMTC）是一家高性能半导体、物联网系统和云连接服务提供商，致力于提供高质量的技术解决方案，以实现更智能、更互联和可持续的地球。我们的全球团队致力于赋能解决方案架构师和应用开发人员，为基础设施、工业和消费市场开发突破性产品。要了解更多关于 Semtech 技术的信息，请访问 Semtech.com 或在 LinkedIn 或 X 上关注我们。</p>
</div><p>SMTC-F</p>
<div class="lb-trans"><p>SMTC-F</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://cts.businesswire.com/ct/CT/query-ZGlzdHJvPW54JmlkPWJ3bmV3cyZsYW5nPWVuJnNpZD1hY3FyOCZzdHk9MjAyNjAzMDM0NDQxMzhyMQ" alt="" original-src="https://cts.businesswire.com/ct/CT?id=bwnews&amp;sty=20260303444138r1&amp;sid=acqr8&amp;distro=nx&amp;lang=en"/></p>
<p>View source version on businesswire.com: https://www.businesswire.com/news/home/20260303444138/en/</p>
<div class="lb-trans"><p>在 businesswire.com 查看源版本：https://www.businesswire.com/news/home/20260303444138/en/</p>
</div><p>Investors: Mitch Haws, webir@semtech.com</p>
<div class="lb-trans"><p>投资者：Mitch Haws，webir@semtech.com</p>
</div><p>Media: Michelle Lozada, pr@semtech.com</p>
<div class="lb-trans"><p>媒体：Michelle Lozada，pr@semtech.com</p>
</div><p>Source: Semtech Corporation</p>
<div class="lb-trans"><p>来源：Semtech 公司</p>
</div>

先科电子通过收购 HieFo 公司来扩展其数据中心产品组合 | SMTC 股票新闻