<div id="readability-page-1"><div id="parent_top_div">Heterogeneous Integration Packaging Solutions Pvt Ltd (3D Glass Solutions) on Sunday kicked off work on India’s first advanced 3D glass chip packaging unit at Info Valley in Bhubaneswar. This is one of the four semiconductor projects approved by the Centre under the India Semiconductor Mission in August 2025. With a proposed investment of around ₹1,943 crore, the unit is expected to place Odisha among emerging global hubs for next-generation chip packaging technology. Once operational, the plant is projected to manufacture about 50 million assembled semiconductor units annually, significantly scaling up India’s chip packaging capacity. Backed by US technology and specialising in 3D Glass Solutions (3DGS), the company is eyeing both domestic and global markets. The project, which will generate more than 2,500 direct and indirect jobs, aims to advance high-performance computing, Artificial Intelligence (AI), and Internet of Things (IoT), marking a major step in India’s semiconductor roadmap. Babu Mandava, president and CEO of 3D Glass Solutions, said packaging is a key component of the semiconductor ecosystem. With advanced technology, the company will build large substrates with high dimensional stability. It specialises in glass-based RF and millimetre-wave packaging substrates. “We are here to build large substrates with high dimensional stability and very high interconnect density, along with very low loss. Our goal is to develop the most sophisticated technology and build an advanced fabrication unit with the highest capacity. This is just the beginning,” he said. Chief Minister Mohan Charan Majhi laid the foundation stone for the project in the presence of Union Electronics and IT Minister Ashwini Vaishnaw, senior officials, industry representatives, investors, and academic leaders. The project is seen as a strategic step in India’s drive to build a domestic semiconductor ecosystem and reduce dependence on imports of critical electronics technologies. Speaking at the event, Majhi said Odisha's industrial landscape is evolving rapidly and is no longer anchored solely in traditional sectors, but is embracing technology, innovation, and high-value manufacturing. “This is a landmark moment as we break ground on India's first advanced 3D glass chip packaging unit. This visionary project will unlock significant employment opportunities and firmly establish Odisha as a serious force in advanced electronics manufacturing,” he said. The Chief Minister added that Odisha is charting a decisive course towards becoming a hub for next-generation industries, contributing to the vision of an Atmanirbhar Bharat. “This project will position Odisha at the forefront of global electronics manufacturing and artificial intelligence, accelerating the state's transformation from a mineral-driven economy to a knowledge-driven one, where the brilliance of Odia talent meets world-class infrastructure. This is not merely an industrial investment; it is a declaration of where the technologies of tomorrow will be built,” he said. Unlike conventional chip assembly units, the Bhubaneswar project will focus on advanced glass substrate packaging and 3D heterogeneous integration technologies, which are regarded as the future of high-performance semiconductor manufacturing. These technologies enable multiple chips, sensors, and components to be stacked or integrated into compact modules that offer faster speeds, lower power consumption, and greater computing efficiency. The facility is expected to produce glass interposers with passive components, silicon bridge solutions, and 3D heterogeneous integration modules. These products are used in high-end sectors including defence electronics, aerospace systems, artificial intelligence computing, RF communications, automotive electronics, photonics, co-packaged optics, and next-generation data centres. Union Minister Ashwini Vaishnaw described the occasion as a historic day for Odisha, saying the state was rapidly diversifying from its traditional minerals-and-metals base into advanced technology sectors such as electronics manufacturing and IT. “The project moved from approval to groundbreaking within months, underlining the fast-track implementation push under the Centre’s semiconductor mission,” he said. The project also gives Odisha a unique distinction. With the upcoming SiCSem compound semiconductor fabrication project and the 3D Glass Solutions packaging facility, Odisha will become the first Indian state to host both a compound semiconductor fab and an advanced glass substrate-based packaging unit.</div></div>

动态半导体 ETF - Invesco

费城交易所 半导体 ETF - iShares

嘉实上证科创板芯片ETF

异构集成封装解决方案私人有限公司已在布巴内斯瓦尔启动印度首个先进 3D 玻璃芯片封装厂的建设，投资额为 1943 亿印度卢比。该项目是印度半导体使命的一部分，旨在每年生产 5000 万个半导体单元，并创造超过 2500 个就业机会。它专注于先进的玻璃基板封装和 3D 异构集成技术，将奥里萨邦定位为下一代电子制造的中心，并减少对进口的依赖。该项目预计将增强印度的半导体生态系统，并支持高性能计算和人工智能的进步

印度首个先进的 3D 玻璃芯片封装工厂将在布巴内斯瓦尔建立