<p>（第一财经）5 月 26 日——在中国化学新材料供应商鼎龙股份宣布其子公司获得中国一家知名逻辑芯片代工厂的优秀供应商奖后，鼎龙的股价大幅上涨，表彰其在两种半导体抛光浆料的稳定供应和支持服务方面的卓越表现。</p>
<p>鼎龙 [深交所：300054] 今日收盘上涨 3.3%，报 79.55 元人民币（11.71 美元）每股。跟踪深圳创业板上市公司的创业板指数上涨 0.5%。</p>
<p>鼎龙昨日晚间宣布，鼎泽新材料科技的浆料使用自研发和生产的磨料颗粒作为核心材料。高 k 金属栅铝氧化物抛光浆料是先进工艺芯片制造的关键材料，具有高技术壁垒和严格的工艺兼容性要求，长期以来被海外公司垄断。</p>
<p>由于产品性能优异和质量稳定一致，鼎龙已为该代工厂提供了三年的稳定大宗供应，完全满足其在先进工艺芯片大规模生产中的原材料需求，该公司强调。</p>
<p>此外，鼎龙的成熟工艺铜阻挡层抛光浆料在与中国同行的竞争中也表现出色，不仅获得了该代工厂的订单并实现长期大宗供应，还最近获得了成熟工艺晶圆制造领域新客户的订单，成为其第三个相关客户。</p>
<p>鼎龙开发的碳化硅基板抛光浆料最近也获得了来自多个客户的大宗订单，标志着该公司产品进入第三代半导体 SiC 基板的抛光应用领域，该公司表示，这一成就是在第三代半导体材料市场从零到一的关键突破。</p>
<p>这些突破充分显示了鼎龙在半导体化学机械抛光浆料领域对核心技术壁垒的掌握和成熟的市场导向服务能力，该公司指出。这将有助于加深与中国主要晶圆制造商的联系，加速先进工艺、成熟工艺和第三代半导体核心耗材的本地化进程。</p>
<p>半导体抛光浆料是通过将液体化学剂与纳米级固体颗粒混合而成的悬浮液，是芯片制造过程中的核心耗材。其配方具有高技术壁垒和较长的客户认证周期，全球市场由海外公司主导。</p>
<p>鼎龙在武汉总部拥有年产 5000 吨抛光浆料的生产线，在仙桃设有年产 10000 吨 CMP 浆料的工厂，并配备有纳米级磨料颗粒的支持生产线。</p>
<p>编辑：马丁·卡迪耶夫</p>

鼎龙股份

<p>鼎龙股份的股价上涨了 3.3%，原因是其子公司获得了中国一家主要芯片代工厂颁发的优秀供应商奖，表彰其半导体抛光浆料。该公司在先进芯片生产方面保持了稳定的供应，并在成熟工艺领域获得了新订单。鼎龙在第三代半导体抛光浆料方面的突破凸显了其技术能力，并旨在加强与中国晶圆制造商的联系</p>

<p>(Yicai) May 26 -- Shares of Dinglong jumped after the Chinese chemical new materials supplier said its subsidiary has received an Excellent Supplier Award from a prominent logic chip foundry in China, recognizing its outstanding performance in the stable supply and supporting services of two types of semiconductor polishing slurries.</p>
<div class="lb-trans"><p>（第一财经）5 月 26 日——在中国化学新材料供应商鼎龙股份宣布其子公司获得中国一家知名逻辑芯片代工厂的优秀供应商奖后，鼎龙的股价大幅上涨，表彰其在两种半导体抛光浆料的稳定供应和支持服务方面的卓越表现。</p>
</div><p>Dinglong [SHE: 300054] closed up 3.3 percent at CNY79.55 (USD11.71) a share today. The ChiNext Index, which tracks firms listed on Shenzhen's Growth Enterprise Market, rose 0.5 percent.</p>
<div class="lb-trans"><p>鼎龙 [深交所：300054] 今日收盘上涨 3.3%，报 79.55 元人民币（11.71 美元）每股。跟踪深圳创业板上市公司的创业板指数上涨 0.5%。</p>
</div><p>Dingze New Material Technology's slurries use self-developed and produced abrasive particles as core materials, Dinglong announced late yesterday. The high-k metal gate alumina polishing slurry is a critical material for advanced process chip manufacturing, characterized by high technical barriers and stringent process compatibility requirements, which have long been monopolized by overseas companies, it pointed out.</p>
<div class="lb-trans"><p>鼎龙昨日晚间宣布，鼎泽新材料科技的浆料使用自研发和生产的磨料颗粒作为核心材料。高 k 金属栅铝氧化物抛光浆料是先进工艺芯片制造的关键材料，具有高技术壁垒和严格的工艺兼容性要求，长期以来被海外公司垄断。</p>
</div><p>Owing to the excellent product performance and stable quality consistency, Dinglong has seen three years of stable bulk supply for the foundry, fully meeting its demand for raw materials in the mass production of advanced process chips, the Wuhan-based firm stressed.</p>
<div class="lb-trans"><p>由于产品性能优异和质量稳定一致，鼎龙已为该代工厂提供了三年的稳定大宗供应，完全满足其在先进工艺芯片大规模生产中的原材料需求，该公司强调。</p>
</div><p>In addition, Dinglong's copper barrier layer polishing slurry for mature processes has also excelled in competition with Chinese peers, not only securing orders from the foundry and achieving long-term bulk supply, but also recently landing orders from a new client in the mature process wafer manufacturing sector, making it its third relevant customer, the company noted.</p>
<div class="lb-trans"><p>此外，鼎龙的成熟工艺铜阻挡层抛光浆料在与中国同行的竞争中也表现出色，不仅获得了该代工厂的订单并实现长期大宗供应，还最近获得了成熟工艺晶圆制造领域新客户的订单，成为其第三个相关客户。</p>
</div><p>Dinglong's developed silicon carbide substrate polishing slurry has also recently secured bulk orders from several clients, marking the entry of the firm's products into the polishing application field for third-generation semiconductor SiC substrates, the company said, noting that the achievement is a critical breakthrough from zero to one in the market for third-gen semiconductor materials.</p>
<div class="lb-trans"><p>鼎龙开发的碳化硅基板抛光浆料最近也获得了来自多个客户的大宗订单，标志着该公司产品进入第三代半导体 SiC 基板的抛光应用领域，该公司表示，这一成就是在第三代半导体材料市场从零到一的关键突破。</p>
</div><p>The breakthroughs fully show Dinglong's mastery of core technical barriers and mature market-oriented service capabilities in the area of semiconductor chemical-mechanical polishing slurries, the company pointed out. They will help to deepen the firm's ties with key Chinese wafer manufacturers, accelerating the localization process of core consumables for advanced processes, mature processes, and third-gen semiconductors, it added.</p>
<div class="lb-trans"><p>这些突破充分显示了鼎龙在半导体化学机械抛光浆料领域对核心技术壁垒的掌握和成熟的市场导向服务能力，该公司指出。这将有助于加深与中国主要晶圆制造商的联系，加速先进工艺、成熟工艺和第三代半导体核心耗材的本地化进程。</p>
</div><p>Semiconductor polishing slurries are a suspension made by mixing liquid chemical agents with nano-sized solid particles and are a core consumable in the chip manufacturing process. Their formulation has a high technical barrier and a lengthy customer certification cycle, with the global market dominated by overseas companies.</p>
<div class="lb-trans"><p>半导体抛光浆料是通过将液体化学剂与纳米级固体颗粒混合而成的悬浮液，是芯片制造过程中的核心耗材。其配方具有高技术壁垒和较长的客户认证周期，全球市场由海外公司主导。</p>
</div><p>Dinglong has a production line for polishing slurries with an annual capacity of 5,000 tons at its headquarters in Wuhan and a plant in Xiantao with an annual capacity of 10,000 tons of CMP slurries, along with supporting production lines for nano-sized abrasive particles.</p>
<div class="lb-trans"><p>鼎龙在武汉总部拥有年产 5000 吨抛光浆料的生产线，在仙桃设有年产 10000 吨 CMP 浆料的工厂，并配备有纳米级磨料颗粒的支持生产线。</p>
</div><p>Editor: Martin Kadiev</p>
<div class="lb-trans"><p>编辑：马丁·卡迪耶夫</p>
</div>

鼎龙股份在其中国公司旗下单位获得芯片抛光浆料优秀供应商奖后股价上涨