<p>，/PRNewswire/ -- 隨着全球智能手機銷售趨於平穩，高通和聯發科將其長期競爭帶入快速增長的雲 AI ASIC 市場。DIGITIMES Research 估計，聯發科在 2024 年控制了 37% 的智能手機應用處理器市場，領先於高通的 27%。兩家供應商的出貨量合計超過 60%。由於手機增長預計將停滯在低個位數，兩家公司正轉向雲計算芯片作為新的擴展來源。</p>
<p><strong>在 COMPUTEX 上揭示的雲戰略</strong></p>
<p>繼續閲讀</p>
<p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null"/></p>
<p>來源：DIGITIMES</p>
<p>高通和聯發科概述了雲 AI 芯片的新戰略，並確認計劃加入 Nvidia 的 NVLink Fusion 聯盟，表明他們打算與高性能計算領域的現有企業競爭。這些舉措在 2025 年 COMPUTEX 上宣佈，突顯了芯片製造商在 AI 基礎設施中爭奪優勢的緊迫性，其中高性能計算 SoC 設計、SerDes 互連和先進製造節點的專業知識至關重要。</p>
<p><strong>聯發科專注於速度和合作夥伴關係</strong></p>
<p>DIGITIMES Research 分析師 Joyce Chen 表示，聯發科的競爭優勢在於速度。該公司依賴 Arm 參考設計和台積電的先進節點，在智能手機和 Chromebook 中積累了大規模生產的專業知識。它還加入了 Nvidia 的 DGX Spark GB10 項目，並與谷歌在 TPU 開發上合作，加速其向雲 AI ASIC 的推進。聯發科展示了 224G SerDes 技術，表明其內部互連的實力，並通過與 Nvidia 和谷歌的聯盟獲得了先發優勢。</p>
<p><strong>高通強調深度和整合</strong></p>
<p>高通採取了不同的路徑，專注於更深的整合。自 2021 年收購 Nuvia 以來，該公司已將其 Oryon CPU 構建為其專有 IP 組合的基石。其在 2025 年收購 Alphawave 填補了 SerDes 和高速互連的空白，創建了更完整的技術棧。高通還與台積電和三星保持雙重代工選擇，增強了生產靈活性。其 Cloud AI 100 和 Ultra AI 加速卡已在邊緣推理服務器中部署，並正在為大型語言模型的訓練和推理準備芯片。</p>
<p><strong>可能重塑 AI ASIC 競爭的對抗</strong></p>
<p>Chen 表示，兩家公司現在都有能力在雲 AI ASIC 市場競爭。聯發科的速度使其獲得了早期優勢，而高通則通過收購強化了其技術基礎。Chen 指出，結果將取決於每家公司如何管理成本、滿足對計算能力日益增長的需求、確保先進的製造能力以及與雲服務提供商建立合作伙伴關係。她補充説，可以肯定的是，高通和聯發科正在將他們的競爭擴展到智能手機之外，進入雲 AI 芯片領域——這場競爭可能有助於定義人工智能硬件競爭的下一個時代。</p>
<p>來源：DIGITIMES ASIA</p>
<p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUwOTI1Jk5ld3NJdGVtSWQ9SEs4MDk0MCZUcmFuc21pc3Npb25fSWQ9MjAyNTA5MjUyMjAwUFJfTkVXU19VU1BSX19fX19ISzgwOTQw?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUwOTI1Jk5ld3NJdGVtSWQ9SEs4MDk0MCZUcmFuc21pc3Npb25fSWQ9MjAyNTA5MjUyMjAwUFJfTkVXU19VU1BSX19fX19ISzgwOTQw"/></p>

聯發科

<p>高通和聯發科正在將他們的競爭擴展到雲端人工智能 ASIC 市場，因為全球智能手機銷售停滯不前。聯發科在智能手機應用處理器市場佔有 37% 的份額，而高通則佔有 27%。兩家公司都加入了英偉達的 NVLink Fusion 聯盟，以增強他們的雲端人工智能芯片戰略。聯發科專注於速度和合作夥伴關係，利用 Arm 設計和台積電的先進工藝節點，而高通則強調集成，並通過收購加強了其技術。他們在雲端人工智能領域的競爭可能會重塑人工智能硬件的未來</p>

<p>, /PRNewswire/ -- With global smartphone sales leveling off, Qualcomm and MediaTek are taking their long-running rivalry into the fast-growing cloud AI ASIC market. DIGITIMES Research estimates MediaTek controlled 37% of the smartphone application processor market in 2024, ahead of Qualcomm at 27%. Together, the two suppliers accounted for more than 60% of shipments. With handset growth expected to remain stuck in the low single digits, both companies are turning to cloud computing chips as a new source of expansion.</p>
<div class="lb-trans"><p>，/PRNewswire/ -- 隨着全球智能手機銷售趨於平穩，高通和聯發科將其長期競爭帶入快速增長的雲 AI ASIC 市場。DIGITIMES Research 估計，聯發科在 2024 年控制了 37% 的智能手機應用處理器市場，領先於高通的 27%。兩家供應商的出貨量合計超過 60%。由於手機增長預計將停滯在低個位數，兩家公司正轉向雲計算芯片作為新的擴展來源。</p>
</div><p><strong>Cloud strategies unveiled at COMPUTEX</strong></p>
<div class="lb-trans"><p><strong>在 COMPUTEX 上揭示的雲戰略</strong></p>
</div><p>Continue Reading</p>
<div class="lb-trans"><p>繼續閲讀</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null" alt="" original-src="https://www.prnewswire.com/news-releases/null"/></p>
<p>Credit: DIGITIMES</p>
<div class="lb-trans"><p>來源：DIGITIMES</p>
</div><p>Qualcomm and MediaTek outlined new strategies for cloud AI chips and confirmed plans to join Nvidia's NVLink Fusion consortium, signaling their intent to take on incumbents in high-performance computing. The moves, announced at COMPUTEX 2025, underscore how chipmakers are racing to secure an edge in AI infrastructure, where expertise in HPC SoC design, SerDes interconnects, and advanced manufacturing nodes is critical to compete.</p>
<div class="lb-trans"><p>高通和聯發科概述了雲 AI 芯片的新戰略，並確認計劃加入 Nvidia 的 NVLink Fusion 聯盟，表明他們打算與高性能計算領域的現有企業競爭。這些舉措在 2025 年 COMPUTEX 上宣佈，突顯了芯片製造商在 AI 基礎設施中爭奪優勢的緊迫性，其中高性能計算 SoC 設計、SerDes 互連和先進製造節點的專業知識至關重要。</p>
</div><p><strong>MediaTek focuses on speed and partnerships</strong></p>
<div class="lb-trans"><p><strong>聯發科專注於速度和合作夥伴關係</strong></p>
</div><p>DIGITIMES Research analyst Joyce Chen said MediaTek's competitive edge lies in speed. The company has relied on Arm reference designs and TSMC's advanced nodes, building up mass-production know-how in smartphones and Chromebooks. It has also joined Nvidia's DGX Spark GB10 project and partnered with Google on TPU development, accelerating its push into cloud AI ASICs. MediaTek has demonstrated 224G SerDes technology, signaling its in-house interconnect strength and giving it a first-mover advantage through alliances with Nvidia and Google.</p>
<div class="lb-trans"><p>DIGITIMES Research 分析師 Joyce Chen 表示，聯發科的競爭優勢在於速度。該公司依賴 Arm 參考設計和台積電的先進節點，在智能手機和 Chromebook 中積累了大規模生產的專業知識。它還加入了 Nvidia 的 DGX Spark GB10 項目，並與谷歌在 TPU 開發上合作，加速其向雲 AI ASIC 的推進。聯發科展示了 224G SerDes 技術，表明其內部互連的實力，並通過與 Nvidia 和谷歌的聯盟獲得了先發優勢。</p>
</div><p><strong>Qualcomm emphasizes depth and integration</strong></p>
<div class="lb-trans"><p><strong>高通強調深度和整合</strong></p>
</div><p>Qualcomm is taking a different path, focusing on deeper integration. Since acquiring Nuvia in 2021, the company has built its Oryon CPU into a cornerstone of its proprietary IP portfolio. Its 2025 acquisition of Alphawave filled gaps in SerDes and high-speed interconnects, creating a more complete technology stack. Qualcomm also maintains dual foundry options with TSMC and Samsung, enhancing production flexibility. Its Cloud AI 100 and Ultra AI accelerator cards are already deployed in edge inference servers, and it is preparing chips designed for large language model training and inference.</p>
<div class="lb-trans"><p>高通採取了不同的路徑，專注於更深的整合。自 2021 年收購 Nuvia 以來，該公司已將其 Oryon CPU 構建為其專有 IP 組合的基石。其在 2025 年收購 Alphawave 填補了 SerDes 和高速互連的空白，創建了更完整的技術棧。高通還與台積電和三星保持雙重代工選擇，增強了生產靈活性。其 Cloud AI 100 和 Ultra AI 加速卡已在邊緣推理服務器中部署，並正在為大型語言模型的訓練和推理準備芯片。</p>
</div><p><strong>Rivalry that could reshape AI ASIC competition</strong></p>
<div class="lb-trans"><p><strong>可能重塑 AI ASIC 競爭的對抗</strong></p>
</div><p>Chen said both companies now have the capacity to compete in the cloud AI ASIC market. MediaTek's speed gives it an early edge, while Qualcomm has reinforced its technology base through acquisitions. The outcome, Chen noted, will hinge on how well each can manage costs, meet rising demand for computing power, secure advanced manufacturing capacity, and forge partnerships with cloud providers. What is certain, she added, is that Qualcomm and MediaTek are carrying their rivalry beyond smartphones and into cloud AI chips — a contest that could help define the next era of competition in artificial intelligence hardware.</p>
<div class="lb-trans"><p>Chen 表示，兩家公司現在都有能力在雲 AI ASIC 市場競爭。聯發科的速度使其獲得了早期優勢，而高通則通過收購強化了其技術基礎。Chen 指出，結果將取決於每家公司如何管理成本、滿足對計算能力日益增長的需求、確保先進的製造能力以及與雲服務提供商建立合作伙伴關係。她補充説，可以肯定的是，高通和聯發科正在將他們的競爭擴展到智能手機之外，進入雲 AI 芯片領域——這場競爭可能有助於定義人工智能硬件競爭的下一個時代。</p>
</div><p>SOURCE DIGITIMES ASIA</p>
<div class="lb-trans"><p>來源：DIGITIMES ASIA</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjUwOTI1Jk5ld3NJdGVtSWQ9SEs4MDk0MCZUcmFuc21pc3Npb25fSWQ9MjAyNTA5MjUyMjAwUFJfTkVXU19VU1BSX19fX19ISzgwOTQw" alt="" original-src="https://rt.prnewswire.com/rt.gif?NewsItemId=HK80940&amp;Transmission_Id=202509252200PR_NEWS_USPR_____HK80940&amp;DateId=20250925"/></p>

DIGITIMES 亞洲科技論壇 2025：高通和聯發科在 AI 芯片領域將智能手機競爭擴展至雲端