<p>, /PRNewswire/ -- <strong>根據 MarketsandMarkets™的報告，</strong> 全球混合鍵合市場預計將在 2032 年達到 6.339 億美元，2025 年為 1.647 億美元，2025 年至 2032 年期間的年均增長率為 21.2%。</p>
<p><strong>瀏覽 150 個市場數據表和 60 個圖表，涵蓋 250 頁的詳細目錄，主題為&#34;</strong> <strong>混合鍵合市場 - 全球預測到 2032 年&#34;</strong></p>
<p><strong>混合鍵合市場</strong> <strong>規模與預測：</strong></p>
<ul>
<li><strong>可用市場規模年份：</strong> 2020–2032</li>
<li><strong>2025 年市場規模：</strong> 1.647 億美元</li>
<li><strong>2032 年預計市場規模：</strong> 6.339 億美元</li>
<li><strong>年均增長率（2025–2032）：</strong> 21.2%</li>
</ul>
<p><strong>混合鍵合市場</strong> <strong>趨勢與洞察：</strong></p>
<ul>
<li>市場受到半導體行業向 3D 集成轉型的推動，以克服規模限制，實現更高的帶寬、更低的功耗和更精細的互連密度。芯片組、先進邏輯、內存堆疊和 CIS 設備的日益採用進一步加速了對超精確鍵合工藝的需求。</li>
<li>按包裝架構，2025 年至 2032 年期間，芯片對芯片（D2D）預計將展現出 35.3% 的年均增長率。</li>
<li>按工藝流程，預計後端環節將在預測期內主導市場。</li>
<li>按設備類型，晶圓鍵合設備預計將在 2025 年至 2032 年期間展現出最高的年均增長率。</li>
<li>亞太地區的混合鍵合市場在 2024 年佔據了 51.6% 的收入份額。</li>
</ul>
<p><strong>下載 PDF 手冊：</strong> https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=2641237</p>
<p>混合鍵合市場受到半導體行業向 3D 集成轉型的推動，以克服規模限制，實現更高的帶寬、更低的延遲和更高的能效。AI、高性能計算（HPC）和先進邏輯設備中芯片組架構的日益採用加速了對超細間距互連的需求。內存堆疊和 CIS 製造進一步推動了對高精度鍵合技術的需求。晶圓廠和 IDM 在先進封裝能力上的大量投資，加上計量、等離子體激活和表面準備的改進，增強了市場的動力。整體向更小、更快和更節能設備的推動繼續加強全球混合鍵合的採用。</p>
<p><strong>晶圓鍵合設備在 2024 年佔據了最大的市場份額</strong></p>
<p>晶圓鍵合設備在 2024 年佔據了混合鍵合市場的最大份額，因為晶圓對晶圓（W2W）混合鍵合提供了最高的對準精度、工藝一致性和產量，使其非常適合內存、CIS 和 3D 邏輯設備的大規模生產。它們在整個晶圓上提供一致的鍵合性能，顯著提高了良率並減少了工藝變異性。隨着領先的晶圓廠和內存製造廠擴大 3D 集成，晶圓鍵合設備仍然是支持這些擴展的基礎設備類別。等離子體激活、對準光學和晶圓處理的持續進步進一步鞏固了它們的主導地位。W2W 生產線的強大裝機基礎進一步鞏固了它們作為主要鍵合技術的地位。</p>
<p><strong>異構集成領域預計將在 2025 年至 2032 年期間記錄最高的年均增長率</strong></p>
<p>異構集成在預測期內預計將記錄最高的年均增長率，因為行業迅速轉向集成邏輯、內存、模擬、射頻和加速器的芯片組架構。混合鍵合使得實現高帶寬、低功耗和改善系統級性能所需的超密集垂直互連成為可能。這些多芯片組件中的 AI 加速器、高性能計算處理器和先進移動系統單芯片（SoC）越來越依賴於芯片組設計，顯著加速了對異構集成的需求。混合不同工藝節點、材料和功能模塊的能力提供了主要的成本和性能優勢，推動了採用。隨着系統級擴展變得至關重要，異構集成成為最具活力的增長領域。</p>
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<p><strong>預計中國將在 2025 年佔據全球混合鍵合市場的最大份額</strong></p>
<p>中國預計將在亞太地區和全球的混合鍵合行業中領先，原因在於其龐大的半導體制造規模、深度的供應鏈整合以及先進封裝能力的持續擴展。該國正在大力投資於 3D 集成、晶圓級封裝和國內設備開發，以減少對全球供應商的依賴，加速主要內存、CIS 和邏輯製造廠的混合鍵合採用。大型政府支持的項目和資金倡議進一步加強了向先進封裝技術自給自足的推動。憑藉高產量、來自消費電子和 AI 驅動應用的強勁需求，以及新制造廠和 OSAT 生產線的快速部署，中國被定位為塑造全球混合鍵合增長的主導力量。</p>
<p><strong>主要參與者</strong></p>
<p>在混合鍵合領域運營的主要公司包括 EV Group (EVG)（奧地利）、應用材料公司（美國）、SUSS MicroTec SE（德國）、Besi（荷蘭）、Kulicke &amp; Soffa Industries, Inc.（新加坡）、東京電子（TEL）（日本）和 ASMPT（新加坡）等。</p>
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應用材料

<p>全球混合鍵合市場預計將從 2025 年的 1.647 億美元增長到 2032 年的 6.339 億美元，年均增長率為 21.2%。這一增長受到半導體行業向 3D 集成和芯片架構採用的推動。亞太地區，特別是中國，預計將引領市場。主要參與者包括 EV Group、應用材料和 SUSS MicroTec。由於其高對準精度和產量，晶圓鍵合設備細分市場預計將佔據主導地位</p>

<p>, /PRNewswire/ -- <strong>According to MarketsandMarkets™,</strong> the global Hybrid Bonding Market is projected to reach USD 633.9 million by 2032 from USD 164.7 million in 2025, registering a CAGR of 21.2% from 2025 to 2032.</p>
<div class="lb-trans"><p>, /PRNewswire/ -- <strong>根據 MarketsandMarkets™的報告，</strong> 全球混合鍵合市場預計將在 2032 年達到 6.339 億美元，2025 年為 1.647 億美元，2025 年至 2032 年期間的年均增長率為 21.2%。</p>
</div><p><strong>Browse 150 market data Tables and 60 Figures spread through 250 Pages and in-depth TOC on &#34;</strong> <strong>Hybrid Bonding Market - Global Forecast to 2032&#34;</strong></p>
<div class="lb-trans"><p><strong>瀏覽 150 個市場數據表和 60 個圖表，涵蓋 250 頁的詳細目錄，主題為&#34;</strong> <strong>混合鍵合市場 - 全球預測到 2032 年&#34;</strong></p>
</div><p><strong>Hybrid Bonding Market</strong> <strong>Size &amp; Forecast:</strong></p>
<div class="lb-trans"><p><strong>混合鍵合市場</strong> <strong>規模與預測：</strong></p>
</div><ul>
<li><strong>Market Size Available for Years:</strong> 2020–2032</li>
<li><strong>2025 Market Size:</strong> USD 164.7 million</li>
<li><strong>2032 Projected Market Size:</strong> USD 633.9 million</li>
<li><strong>CAGR (2025–2032):</strong> 21.2%</li>
</ul>
<div class="lb-trans"><ul>
<li><strong>可用市場規模年份：</strong> 2020–2032</li>
<li><strong>2025 年市場規模：</strong> 1.647 億美元</li>
<li><strong>2032 年預計市場規模：</strong> 6.339 億美元</li>
<li><strong>年均增長率（2025–2032）：</strong> 21.2%</li>
</ul>
</div><p><strong>Hybrid Bonding Market</strong> <strong>Trends &amp; Insights:</strong></p>
<div class="lb-trans"><p><strong>混合鍵合市場</strong> <strong>趨勢與洞察：</strong></p>
</div><ul>
<li>The market is driven by the semiconductor industry's shift toward 3D integration to overcome scaling limits and achieve higher bandwidth, lower power, and finer interconnect density. Rising adoption of chiplets, advanced logic, memory stacking, and CIS devices further accelerates the demand for ultra-precise bonding processes.</li>
<li>By Packaging Architecture, Die-to-die (D2D) to exhibit a CAGR of 35.3% between 2025 and 2032.</li>
<li>By process flow, the back-end segment is expected to dominate the market during the forecast period.</li>
<li>By equipment type, the wafer bonders segment is likely to exhibit the highest CAGR from 2025 to 2032.</li>
<li>The Asia Pacific hybrid bonding market accounted for a 51.6% revenue share in 2024.</li>
</ul>
<div class="lb-trans"><ul>
<li>市場受到半導體行業向 3D 集成轉型的推動，以克服規模限制，實現更高的帶寬、更低的功耗和更精細的互連密度。芯片組、先進邏輯、內存堆疊和 CIS 設備的日益採用進一步加速了對超精確鍵合工藝的需求。</li>
<li>按包裝架構，2025 年至 2032 年期間，芯片對芯片（D2D）預計將展現出 35.3% 的年均增長率。</li>
<li>按工藝流程，預計後端環節將在預測期內主導市場。</li>
<li>按設備類型，晶圓鍵合設備預計將在 2025 年至 2032 年期間展現出最高的年均增長率。</li>
<li>亞太地區的混合鍵合市場在 2024 年佔據了 51.6% 的收入份額。</li>
</ul>
</div><p><strong>Download PDF Brochure:</strong> https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=2641237</p>
<div class="lb-trans"><p><strong>下載 PDF 手冊：</strong> https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=2641237</p>
</div><p>The hybrid bonding market is driven by the semiconductor industry's shift toward 3D integration to overcome scaling limitations and achieve higher bandwidth, lower latency, and improved power efficiency. The rising adoption of chiplet architectures in AI, HPC, and advanced logic devices accelerates the need for ultra-fine-pitch interconnects. Memory stacking and CIS manufacturing further propel the demand for high-precision bonding technologies. Substantial investments in advanced packaging capacity by foundries and IDMs, coupled with improvements in metrology, plasma activation, and surface preparation, reinforce market momentum. The overall push toward smaller, faster, and more energy-efficient devices continues to strengthen hybrid bonding adoption globally.</p>
<div class="lb-trans"><p>混合鍵合市場受到半導體行業向 3D 集成轉型的推動，以克服規模限制，實現更高的帶寬、更低的延遲和更高的能效。AI、高性能計算（HPC）和先進邏輯設備中芯片組架構的日益採用加速了對超細間距互連的需求。內存堆疊和 CIS 製造進一步推動了對高精度鍵合技術的需求。晶圓廠和 IDM 在先進封裝能力上的大量投資，加上計量、等離子體激活和表面準備的改進，增強了市場的動力。整體向更小、更快和更節能設備的推動繼續加強全球混合鍵合的採用。</p>
</div><p><strong>Wafer bonders segment captured the largest market share in 2024</strong></p>
<div class="lb-trans"><p><strong>晶圓鍵合設備在 2024 年佔據了最大的市場份額</strong></p>
</div><p>Wafer bonders held the largest share of the hybrid bonding market in 2024 as wafer-to-wafer (W2W) hybrid bonding offers the highest alignment accuracy, process uniformity, and throughput, making it ideal for high-volume manufacturing of memory, CIS, and 3D logic devices. Their ability to deliver consistent bonding performance across full wafers significantly improves yield and reduces process variability. As leading foundries and memory fabs scale 3D integration, wafer bonders remain the foundational equipment category supporting these expansions. Continuous advancements in plasma activation, alignment optics, and wafer handling further strengthen their dominance. The strong installed base of W2W production lines reinforces their position as the primary bonding technology.</p>
<div class="lb-trans"><p>晶圓鍵合設備在 2024 年佔據了混合鍵合市場的最大份額，因為晶圓對晶圓（W2W）混合鍵合提供了最高的對準精度、工藝一致性和產量，使其非常適合內存、CIS 和 3D 邏輯設備的大規模生產。它們在整個晶圓上提供一致的鍵合性能，顯著提高了良率並減少了工藝變異性。隨着領先的晶圓廠和內存製造廠擴大 3D 集成，晶圓鍵合設備仍然是支持這些擴展的基礎設備類別。等離子體激活、對準光學和晶圓處理的持續進步進一步鞏固了它們的主導地位。W2W 生產線的強大裝機基礎進一步鞏固了它們作為主要鍵合技術的地位。</p>
</div><p><strong>Heterogeneous integration segment is expected to record the highest CAGR from 2025 to 2032</strong></p>
<div class="lb-trans"><p><strong>異構集成領域預計將在 2025 年至 2032 年期間記錄最高的年均增長率</strong></p>
</div><p>Heterogeneous integration is likely to record the highest CAGR during the forecast period as the industry rapidly transitions to chiplet-based architectures that integrate logic, memory, analog, RF, and accelerators within a single package. Hybrid bonding enables the ultra-dense vertical interconnects required to achieve high bandwidth, low power consumption, and improved system-level performance in these multi-die assemblies. AI accelerators, HPC processors, and advanced mobile SoCs increasingly rely on chiplet designs, significantly accelerating demand for heterogeneous integration. The ability to mix different process nodes, materials, and functional blocks provides major cost and performance advantages, driving the adoption. As system-level scaling becomes critical, heterogeneous integration emerges as the most dynamic growth segment.</p>
<div class="lb-trans"><p>異構集成在預測期內預計將記錄最高的年均增長率，因為行業迅速轉向集成邏輯、內存、模擬、射頻和加速器的芯片組架構。混合鍵合使得實現高帶寬、低功耗和改善系統級性能所需的超密集垂直互連成為可能。這些多芯片組件中的 AI 加速器、高性能計算處理器和先進移動系統單芯片（SoC）越來越依賴於芯片組設計，顯著加速了對異構集成的需求。混合不同工藝節點、材料和功能模塊的能力提供了主要的成本和性能優勢，推動了採用。隨着系統級擴展變得至關重要，異構集成成為最具活力的增長領域。</p>
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<div class="lb-trans"><p><strong>購買前諮詢：</strong> https://www.marketsandmarkets.com/Enquiry_Before_BuyingNew.asp?id=2641237</p>
</div><p><strong>China is anticipated to hold the largest share of the global hybrid bonding market in 2025</strong></p>
<div class="lb-trans"><p><strong>預計中國將在 2025 年佔據全球混合鍵合市場的最大份額</strong></p>
</div><p>China is expected to lead the hybrid bonding industry in Asia Pacific and globally due to its massive semiconductor manufacturing scale, deep supply-chain integration, and continuous expansion of advanced packaging capabilities. The country is investing heavily in 3D integration, wafer-level packaging, and domestic equipment development to reduce reliance on global suppliers, accelerating hybrid bonding adoption across major memory, CIS, and logic fabs. Large government-backed programs and funding initiatives further strengthen the push toward self-sufficiency in advanced packaging technologies. With high-volume production, strong demand from consumer electronics and AI-driven applications, and rapid deployment of new fabs and OSAT lines, China is positioned as the dominant force shaping global hybrid bonding growth.</p>
<div class="lb-trans"><p>中國預計將在亞太地區和全球的混合鍵合行業中領先，原因在於其龐大的半導體制造規模、深度的供應鏈整合以及先進封裝能力的持續擴展。該國正在大力投資於 3D 集成、晶圓級封裝和國內設備開發，以減少對全球供應商的依賴，加速主要內存、CIS 和邏輯製造廠的混合鍵合採用。大型政府支持的項目和資金倡議進一步加強了向先進封裝技術自給自足的推動。憑藉高產量、來自消費電子和 AI 驅動應用的強勁需求，以及新制造廠和 OSAT 生產線的快速部署，中國被定位為塑造全球混合鍵合增長的主導力量。</p>
</div><p><strong>Key Players</strong></p>
<div class="lb-trans"><p><strong>主要參與者</strong></p>
</div><p>Key companies operating in the hybrid bonding companies include EV Group (EVG) (Austria), Applied Materials, Inc. (US), SUSS MicroTec SE (Germany), Besi (Netherlands), Kulicke &amp; Soffa Industries, Inc. (Singapore), Tokyo Electron (TEL) (Japan), and ASMPT (Singapore), among others.</p>
<div class="lb-trans"><p>在混合鍵合領域運營的主要公司包括 EV Group (EVG)（奧地利）、應用材料公司（美國）、SUSS MicroTec SE（德國）、Besi（荷蘭）、Kulicke &amp; Soffa Industries, Inc.（新加坡）、東京電子（TEL）（日本）和 ASMPT（新加坡）等。</p>
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根據 MarketsandMarkets™的獨家報告，混合鍵合市場預計到 2032 年將達到 6.339 億美元